Standards & Documents Search

Displaying 21 - 30 of 35 documents. Show 5 | 10 | 20 results per page.

Title	Document #	Date
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994 Status: Superseded	JESD40	Jul 1994
Committee(s): JC-13 Free download. Registration or login required.
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)	JESD49B.01	Oct 2023
This standard facilitates the procurement and use of semiconductor die products provided in bare or bumped die form, and provides requirements and guidance to die suppliers as to the levels of as-delivered performance, quality and reliability expected. It also reflects the special needs of die product customers in terms of design and application data. Committee(s): JC-13 Free download. Registration or login required.
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices	JESD625C.01	Mar 2024
This standard applies to devices susceptible to damage by electrostatic discharge greater than 100 volts human body model (HBM) and 200 volts charged device model (CDM). Committee(s): JC-13, JC-14.1 Free download. Registration or login required.
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994. Status: Superseded	JESD42	Mar 1994
Committee(s): JC-13 Free download. Registration or login required.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:	JEP121B	Dec 2020
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
SELECTION OF BURN-IN / LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS	JEP163A	Jan 2023
This publication is a guideline to assist manufacturers of integrated circuits in defining conditions for burn-in and life test of their products to meet quality and reliability performance requirements of MIL-PRF-38535. Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES: Removed 01/21/04 Release Number: B	J-STD-002	Feb 2003
At the request of IPC, J-STD-002B has been removed from the free download area. In its place, JEDEC's Test Method, JESD22-B102, Solderability, which includes lead-free, was made available until it was replaced by J-STD-002D. Any revision to J-STD-002 will no longer be available for free to the industry on the JEDEC website. However, the document is available to the JEDEC formulating Committee members, in the Members Area. If you are not a JEDEC member you may wish to try the IPC website or one of the resellers listed at: http://www.jedec.org/standards-document Committee(s): JC-13, JC-14.1
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT Reaffirmed June 2023	JESD213A	Apr 2017
This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engineers, procuring activities and repair centers. This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn/Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment. Reaffirmed June 2023 Committee(s): JC-13 Free download. Registration or login required.
STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS Status: Rescinded, October 2008	JESD390A	Feb 1981
Reaffirmed September 2003 Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP112	Jun 1987
Committee(s): JC-13 Free download. Registration or login required.

Standards & Documents Search

PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994

PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)

Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994.

REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:

SELECTION OF BURN-IN / LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS

SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES:

STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT

STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS

TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: