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Title	Document #	Date
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS Status: Reaffirmed May 2023	JEP142	May 2023
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES Status: Rescinded	JEP96	Jan 1977
Committee(s): JC-13.5
Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification	JEP114A	May 2023
This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS Status: Reaffirmed May 2023	JESD9C	May 2017
The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: External Visual. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP105	Apr 1983
Committee(s): JC-13.5 Free download. Registration or login required.
JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS Status: Rescinded, May 2006	JEP101-C	Nov 1995
Committee(s): JC-13.2 Free download. Registration or login required.
MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002 Status: RescindedOctober 2002	JESD53	Jan 1996
Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
MEASUREMENT AND REPORTING OF ALPHA PARTICLE AND TERRESTRIAL COSMIC RAY INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICES	JESD89B	Sep 2021
This specification defines the standard requirements and procedures for terrestrial soft-error-rate (SER) testing of integrated circuits and reporting of results. Both real-time (unaccelerated) and accelerated testing procedures are described. At terrestrial, Earth-based altitudes, the predominant sources of radiation include both cosmic-ray radiation and alpha-particle radiation from radioisotopic impurities in the package and chip materials. An overall assessment of a deviceís SER is complete, only when an unaccelerated test is done, or accelerated SER data for the alpha-particle component and the cosmic-radiation component has been obtained. Committee(s): JC-13, JC-13.4 Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE	JEP132A.01	Dec 2022
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. Committee(s): JC-13 Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS Status: Rescinded May 2006	EIA623	Jul 1994
Committee(s): JC-13 Free download. Registration or login required.

Standards & Documents Search

GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS

GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES

Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification

INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS

JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001

JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS

MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002

MEASUREMENT AND REPORTING OF ALPHA PARTICLE AND TERRESTRIAL COSMIC RAY INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICES

PROCESS CHARACTERIZATION GUIDELINE

PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS

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