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Displaying 31 - 35 of 35 documents. Show 5 | 10 | 20 results per page.

Title	Document #	Date
SELECTION OF BURN-IN / LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS	JEP163A	Jan 2023
This publication is a guideline to assist manufacturers of integrated circuits in defining conditions for burn-in and life test of their products to meet quality and reliability performance requirements of MIL-PRF-38535. Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification	JEP114A	May 2023
This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS Status: Reaffirmed May 2023	JEP142	May 2023
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)	JESD49B.01	Oct 2023
This standard facilitates the procurement and use of semiconductor die products provided in bare or bumped die form, and provides requirements and guidance to die suppliers as to the levels of as-delivered performance, quality and reliability expected. It also reflects the special needs of die product customers in terms of design and application data. Committee(s): JC-13 Free download. Registration or login required.
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices	JESD625C.01	Mar 2024
This standard applies to devices susceptible to damage by electrostatic discharge greater than 100 volts human body model (HBM) and 200 volts charged device model (CDM). Committee(s): JC-13, JC-14.1 Free download. Registration or login required.

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