Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
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JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP105 | Apr 1983 |
Committee(s): JC-13.5 Free download. Registration or login required. |
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INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERSStatus: Reaffirmed May 2023 |
JESD9C | May 2017 |
The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: External Visual. Free download. Registration or login required. |
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Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification |
JEP114A | May 2023 |
This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing. Free download. Registration or login required. |
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GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICESStatus: Rescinded |
JEP96 | Jan 1977 |
Committee(s): JC-13.5 |
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GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTSStatus: Reaffirmed May 2023 |
JEP142 | May 2023 |
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Free download. Registration or login required. |
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GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGESStatus: Reaffirmed November 2020 |
JEP144A | Nov 2011 |
This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. Committee(s): JC-13 Free download. Registration or login required. |
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GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS: |
JEP133C | Jan 2010 |
A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500. Committee(s): JC-13.5, JC-13.4 Free download. Registration or login required. |
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GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-AStatus: Rescinded |
JESD19 | Jul 1988 |
Committee(s): JC-13 Free download. Registration or login required. |
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GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001Status: Rescinded |
JESD26-A | Apr 1990 |
Committee(s): JC-13.2 Free download. Registration or login required. |
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GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:Status: Rescinded |
JEP109-C | Mar 1995 |
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Free download. Registration or login required. |
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