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Main Memory: DDR SDRAM, HBM
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Main menu
Standards & Documents
Search Standards & Documents
Recently Published Documents
Technology Focus Areas
Main Memory: DDR SDRAM, HBM
Mobile Memory: LPDDR
Flash Memory: SSDs, UFS, e.MMC, XFMD
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
Lead-Free Manufacturing
Type Registration, Data Sheets
Order JEDEC Standard Manufacturer's ID Code
Order ID Code for Low Power Memories
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2025 Honorees
JEDEC Awards: Distinguished Members Recognition
In Memoriam
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
Server/Cloud Computing/AI Forum Korea
Server/Coud Computing/AI Forum Taiwan
Save the Date: Automotive Forum Munich
JEDEC DDR5 Workshop: Recordings for Sale
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Member List
Board of Directors
Committee Chairs
Industry Collaboration
Policies & Governance
Patent Policy
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Contact
RSS Feeds
JEDEC Staff
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Year in Review: 2024
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Recent Documents
SOLID STATE PRODUCTS REGISTRATION LIST(ORDER FROM TYPE ADMINISTRATION OFFICE)
JEP64
Jan 1986
MICROELECTRONIC DEVICE TYPE ASSIGNMENTS
JEP93
Jan 1975
STANDARD MEASURMENTS OF THE ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR INTEGRATED CIRCUITS
JEB6
Jan 1966
