JEDEC Committee:
JC-63 Multiple Chip Packages

JC-63 defines/proposes standards for mixed-technology MCP that address unique electrical, mechanical, test, and architecture issues relating to die-to-die design and manufacturing for commercial applications.

MCP is defined as multichip package, a single package that contains multiple dice, including memory-memory, logic-memory, logic-logic, and/or passive components.

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