JEDEC Committee:

Multiple Chip Packages JC-63

JC-63 defines/proposes standards for mixed-technology MCP that address unique electrical, mechanical, test, and architecture issues relating to die-to-die design and manufacturing for commercial applications.

MCP is defined as multichip package, a single package that contains multiple dice, including memory-memory, logic-memory, logic-logic, and/or passive components.

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Committee Meetings

Eindhoven 5 - 9 Jun 2017
Chicago 28 - 1 Sep 2017
San Francisco 4 - 8 Dec 2017
Taipei 5 - 8 Mar 2018
Vancouver 4 - 7 Jun 2018

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