Global Standards for the Microelectronics Industry
JC-63 Multiple Chip Packages
JC-63 defines/proposes standards for mixed-technology MCP that address unique electrical, mechanical, test, and architecture issues relating to die-to-die design and manufacturing for commercial applications.MCP is defined as multichip package, a single package that contains multiple dice, including memory-memory, logic-memory, logic-logic, and/or passive components.
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|Package-on-Package (PoP) and Internal Stacked Module (ISM)||MCP3.12.2||Jan 2012|
|Silicon Pad Sequence (x16/x32 LPDRAM, x16 PSRAM, x16 NAND). Item JC-63-029||MCP3.12.3||Nov 2006|
|MCP Overview||MCP3.12.0||Jun 2006|