Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-63 Multiple Chip Packages
JC-63 defines/proposes standards for mixed-technology MCP that address unique electrical, mechanical, test, and architecture issues relating to die-to-die design and manufacturing for commercial applications.
MCP is defined as multichip package, a single package that contains multiple dice, including memory-memory, logic-memory, logic-logic, and/or passive components.
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Recent Documents
Package-on-Package (PoP) and Internal Stacked Module (ISM) | MCP3.12.2 | Jan 2012 |
Silicon Pad Sequence (x16/x32 LPDRAM, x16 PSRAM, x16 NAND). Item JC-63-029 | MCP3.12.3 | Nov 2006 |
MCP Overview | MCP3.12.0 | Jun 2006 |