JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
|FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING||JESD659C||Apr 2017|
|TEMPERATURE, BIAS, AND OPERATING LIFE||JESD22-A108E||Dec 2016|
|PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING||JESD22-A113H||Nov 2016|
|RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES||JESD22-B106E||Nov 2016|
|BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS||JESD22-B111A||Nov 2016|
|GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING (Tubes, Trays, and Tape and Reel)||JEP130B||Nov 2016|
|THERMAL SHOCK||JESD22-A106B.01||Nov 2016|
|GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES||JESD31E||Nov 2016|
|TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES||JESD217.01||Oct 2016|
|FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES||JEP122H||Sep 2016|
|JC-14.1||Reliability Test Methods for Packaged Devices|
|JC-14.3||Silicon Devices Reliability Qualification and Monitoring|
|JC-14.4||Quality Processes and Methods|
|JC-14.7||Gallium Arsenide Reliability and Quality Standards|