Global Standards for the Microelectronics Industry
JC-14 Quality and Reliability of Solid State Products
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
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|ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING – REPORTING ESD WITHSTAND LEVELS ON DATASHEETS||JEP178||Apr 2021|
|FLIP CHIP TENSILE PULL||JESD22-B109C||Mar 2021|
|APPLICATION THERMAL DERATING METHODOLOGIES:||JEP149.01||Jan 2021|
|SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNS||JEP162A.01||Jan 2021|
|STEADY-STATE TEMPERATURE-HUMIDITY BIAS LIFE TEST||JESD22-A101D.01||Jan 2021|
|CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES||JEP167A||Nov 2020|
|CYCLED TEMPERATURE HUMIDITY-BIAS WITH SURFACE CONDENSATION LIFE TEST||JESD22-A100E||Nov 2020|
|TEMPERATURE CYCLING||JESD22-A104F||Nov 2020|
|PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING||JESD22-A113I||Apr 2020|
|CUSTOMER NOTIFICATION PROCESS FOR DISASTERS||JESD246A||Jan 2020|