JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95.
The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts.
Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
|Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA||MO-317B.01||Mar 2017|
|Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA||MO-321A.01||Mar 2017|
|Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA||MO-322A.01||Mar 2017|
|Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA||MO-323A.01||Mar 2017|
|Design Requirements - Fine Pitch/Fine Pitch Interstitial Ball Grid Array Packages (FBGA) and (FIBGA). (Covers body sizes ≤ 21 mm)||DR-4.5L||Mar 2017|
|Design Requirements - Fine Pitch Ball Grid Array Package (FBGA). (Covers body sizes >21mm)||DR-4.27D||Mar 2017|
|Registration - Flange Mounted Family, Surface Mount, Peripheral Terminals. R-PSFM-G.||TO-252F||Feb 2017|
|Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.||MS-034G||Jan 2017|
|Registration - Ball Grid Array Family, Rectangle, 0.75 mm Pitch||MO-328A||Jan 2017|
|Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.||MO-234C||Jan 2017|
|JC-11.10||Microelectronic Ceramic Packages|
|JC-11.11||Microelectronic Plastic Packages|