Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-11 Mechanical Standardization
JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95. The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts. Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
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Recent Documents
PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE | MS-012H | Feb 2025 |
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP) | MO-366A | Feb 2025 |
PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE | MS-013H | Feb 2025 |
PLASTIC DUAL FLATPACK, FLAT TERMINAL, RECTANGULAR FAMILY PACKAGE | MO-293C | Jan 2025 |
PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE | MO-203E | Jan 2025 |
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE | MO-365A | Jan 2025 |
PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT) | SO-032D | Nov 2024 |
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY | MO-357D | Nov 2024 |
288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY | MO-329I | Nov 2024 |
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE | MO-362A | Nov 2024 |