Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-11 Mechanical Standardization
JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95. The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts. Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
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Recent Documents
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES | JESD30L | Nov 2023 |
Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM | DR-4.5O | Nov 2023 |
PART MODEL SCHEMAS | JEP30-10v4-0-0 | Nov 2023 |
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements | JEP30-E100C | Nov 2023 |
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements | JEP30-P100C | Nov 2023 |
Part Model Guidelines for Electronic-Device Packages – XML Requirements | JEP30C | Nov 2023 |
Registration - PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT) | SO-032B | Nov 2023 |
Registration - 288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY | MO-329G | Nov 2023 |
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH MICROELECTRONIC ASSEMBLY | MO-358A | Sep 2023 |
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE | MO-359A | Sep 2023 |