Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-11 Mechanical Standardization
JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95. The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts. Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
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Recent Documents
DDR5 262 Pin SODIMM Connector Performance Standard | PS-006B | Sep 2024 |
PLASTIC DUAL SMALL OUTLINE, GULL WING, 0.95 MM PITCH, RECT PACKAGE (TRANSISTOR) | TO-236-I | Sep 2024 |
PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR) | TO-283A | Sep 2024 |
PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE | MO-216H | Sep 2024 |
PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE | MO-354B | Sep 2024 |
PART MODEL SCHEMAS | JEP30-10v6-0-0 | Aug 2024 |
Part Model Guidelines for Electronic-Device Packages – XML Requirements | JEP30E | Aug 2024 |
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements | JEP30-A100B | Aug 2024 |
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements | JEP30-E100E | Aug 2024 |
PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE | MO-153I | Aug 2024 |