Global Standards for the Microelectronics Industry
JC-14 Quality and Reliability of Solid State Products
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
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|PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING||JESD22-A113I||Apr 2020|
|CUSTOMER NOTIFICATION PROCESS FOR DISASTERS||JESD246A||Jan 2020|
|POWER AND TEMPERATURE CYCLING||JESD22-A105D||Jan 2020|
|MARK LEGIBILITY||JESD22-B114B||Jan 2020|
|SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNS||JEP162A||Sep 2019|
|MECHANICAL SHOCK – DEVICE AND SUBASSEMBLY||JESD22-B110B.01||Jun 2019|
|SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES||JEP143D||Jan 2019|
|ANSI/ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL||JS-002-2018||Jan 2019|
|GUIDELINES FOR GaAs MMIC PHEMT/MESFET AND HBT RELIABILITY ACCELERATED LIFE TESTING||JEP118A||Dec 2018|
|Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability||IPC/JEDEC9301-2018||Dec 2018|