Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-11 Mechanical Standardization
JC-11 is responsible for the creation and update of the registered and standard outlines in JEDEC Publication 95. The committee and its subcommittees generate design guidelines, standardized measuring methods for mechanical features, and standard- or registration-type mechanical outlines for microelectronic packages and assemblies, corresponding socket outlines, mechanical, environmental and ergonomic performance specifications, footprints and land patterns, and development of designators for semiconductor device packages. To accomplish these functions, the committee provides technical support and design recommendations to establish and define parameters that ensure mechanical interchangeability of parts. Find JC-11’s complete scope in JM18: JEDEC Committee Scope Manual.
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Recent Documents
SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM | CO-042A | Feb 2025 |
DESIGN GUIDE 4.10, GENERIC SHIPPING & HANDLING MATRIX TRAY | DG-4.10E | Feb 2025 |
288 TERMINAL POSITIONS (287 TERMINALS) DDR5 DIMM SMT 0.85MM PITCH SOCKET | SO-023E | Feb 2025 |
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements | JEP30-T100B.01 | Feb 2025 |
PART MODEL SCHEMAS | JEP30-10v8-0-0 | Feb 2025 |
Part Model Guidelines for Electronic-Device Packages – XML Requirements | JEP30F | Feb 2025 |
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements | JEP30-P100G | Feb 2025 |
Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements | JEP30-S100A.02 | Feb 2025 |
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements | JEP30-E100G | Feb 2025 |
PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements | JEP30-K100 | Feb 2025 |