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Main menu
Standards & Documents
Search Standards & Documents
Recently Published Documents
Technology Focus Areas
Main Memory: DDR4 & DDR5
Mobile Memory: LPDDR, Wide I/O
Flash Memory: SSDs, UFS, e.MMC, XFMD
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
Lead-Free Manufacturing
Type Registration, Data Sheets
Order JEDEC Standard Manufacturer's ID Code
Order ID Code for Low Power Memories
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2023 Honorees
JEDEC Awards: Distinguished Members Recognition
In Memoriam
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
Mobile/Client/AI Computing Forum Korea
Server/Coud Computing/Edge Forum Korea
Mobile/Client/AI Computing Forum Taiwan
Server/Cloud Computing/Edge Forum Taiwan
JEDEC DDR5 Workshop: Recordings for Sale
Automotive Electronics Forum: Save the Date
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Member List
Board of Directors
Committee Chairs
Industry Collaboration
Policies & Governance
Patent Policy
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Contact
RSS Feeds
JEDEC Staff
Website Help
Year in Review: 2022
Login required
Members Area
JC-70 Recent News
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs
Feb 2023
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices
Apr 2021
JEDEC Wide Bandgap Power Semiconductor Committee Publishes its First Guideline for Silicon Carbide (SiC) Based Power Conversion Devices
Feb 2021
JEDEC Wide Bandgap Power Semiconductor Committee Publishes New Test Method for Continuous-Switching Evaluation of GaN Power Conversion Devices
Jan 2021
JEDEC Wide Bandgap Power Semiconductor Committee Publishes Guideline for Switching Reliability Evaluation Procedures for GaN Devices
Feb 2020
JEDEC Wide Bandgap Power Semiconductor Committee Publishes its First Document: Test Method for Dynamic Resistance of GaN HEMT
Feb 2019
New JEDEC Committee for Wide Bandgap Power Semiconductors Invites Industry Participation
Dec 2017
New JEDEC Committee to Set Standards for Wide Bandgap Power Semiconductors
Sep 2017