JC-11 Recent News

JEDEC to Enable Standard 3D Models of Electronic Components	Nov 2018
JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints	Apr 2017
JEDEC Publishes Revision of International Standard for Semiconductor Device Package Components (JESD30G)	Feb 2016
JEDEC Announces Broad Spectrum of 3D-IC Standards Development	Mar 2011
JEDEC Honors Mr. Rudolph “Rudy” Griffin for 35 Years of Service	Nov 2010
JEDEC Publishes Registered Outline for mSATA SSD Assembly	Jan 2010
JEDEC Publishes Registered Outline for 1.8-inch Slim Solid State Drives	May 2009