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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2022 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Presentations for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
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    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
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      • 1990s
      • 2000s
      • 2010s
    • Member List
    • Board of Directors
    • Committee Chairs
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    • Patent Policy
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    • RSS Feeds
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    • Year in Review: 2022
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JC-11 Recent News

JEDEC and Open Compute Project Foundation Form New Collaboration Jan 2023
JEDEC to Enable Standard 3D Models of Electronic Components Nov 2018
JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints Apr 2017
JEDEC Publishes Revision of International Standard for Semiconductor Device Package Components (JESD30G) Feb 2016
JEDEC Announces Broad Spectrum of 3D-IC Standards Development Mar 2011
JEDEC Honors Mr. Rudolph “Rudy” Griffin for 35 Years of Service Nov 2010
JEDEC Publishes Registered Outline for mSATA SSD Assembly Jan 2010
JEDEC Publishes Registered Outline for 1.8-inch Slim Solid State Drives May 2009
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