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Global Standards for the Microelectronics Industry
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Flash Memory: SSDs, UFS, e.MMC
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JEP30: Part Model Guidelines
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Registered Outlines: JEP95
Memory Configurations: JESD21-C
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JC-11: Mechanical Standardization
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JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
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JC-64: Embedded Memory Storage & Removable Memory Cards
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Members Area
Main menu
Standards & Documents
Search Standards & Documents
Technology Focus Areas
Flash Memory: SSDs, UFS, e.MMC
Main Memory: DDR4 & DDR5 SDRAM
JEP30: Part Model Guidelines
Memory Module Design File Registrations
Mobile Memory: LPDDR, Wide I/O, Memory MCP
Registered Outlines: JEP95
Memory Configurations: JESD21-C
Lead-Free Manufacturing
ESD: Electrostatic Discharge
Type Registration, Data Sheets
ID Codes Order Form
ID Codes for Low Power Memories Order Form
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2018 Honorees
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
DDR4 Workshop: Presentations for Sale
ROCS Workshop: Papers for Sale
JEDEC at Flash Memory Summit
ROCS Workshop Interest List
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Activities
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Member List
Board of Directors
Committee Chairs
Policies & Governance
Patent Policy
Contact
Staff
RSS Feeds
Year in Review: 2017
Login required
Members Area
JC-11 Recent News
JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints
Apr 2017
JEDEC Publishes Revision of International Standard for Semiconductor Device Package Components (JESD30G)
Feb 2016
JEDEC Announces Broad Spectrum of 3D-IC Standards Development
Mar 2011
JEDEC Honors Mr. Rudolph “Rudy” Griffin for 35 Years of Service
Nov 2010
JEDEC Publishes Registered Outline for mSATA SSD Assembly
Jan 2010
JEDEC Publishes Registered Outline for 1.8-inch Slim Solid State Drives
May 2009