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Main Memory: DDR4 & DDR5
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Flash Memory: SSDs, UFS, e.MMC, XFMD
Memory Configurations: JESD21-C
Memory Module Design File Registrations
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Registered Outlines: JEP95
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JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
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Year in Review: 2022
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Members Area
Main menu
Standards & Documents
Search Standards & Documents
Recently Published Documents
Technology Focus Areas
Main Memory: DDR4 & DDR5
Mobile Memory: LPDDR, Wide I/O
Flash Memory: SSDs, UFS, e.MMC, XFMD
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
Lead-Free Manufacturing
Type Registration, Data Sheets
Order JEDEC Standard Manufacturer's ID Code
Order ID Code for Low Power Memories
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2023 Honorees
JEDEC Awards: Distinguished Members Recognition
In Memoriam
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
Mobile/Client/AI Computing Forum Korea
Server/Coud Computing/Edge Forum Korea
Mobile/Client/AI Computing Forum Taiwan
Server/Cloud Computing/Edge Forum Taiwan
JEDEC DDR5 Workshop: Recordings for Sale
Automotive Electronics Forum: Save the Date
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Member List
Board of Directors
Committee Chairs
Industry Collaboration
Policies & Governance
Patent Policy
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Contact
RSS Feeds
JEDEC Staff
Website Help
Year in Review: 2022
Login required
Members Area
JC-42 Recent News
JEDEC Creates New Automotive Steering Subcommittee
Mar 2023
JEDEC to Host In-Person Memory Forum and DDR5 Workshop
Apr 2022
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
Jan 2022
JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence
Dec 2021
JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications
Oct 2021
JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
Jul 2021
JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems
Jul 2020
JEDEC Announces Publication of a New Serial Presence Detect Device
Mar 2020
JEDEC Publishes Update to LPDDR5 Standard for Low Power Memory Devices
Jan 2020
JEDEC Honors Dr. Howard Yang of Montage Technology with New Award
Jan 2020
JEDEC to Hold Workshops for DDR5, LPDDR5 & NVDIMM-P Standards
Sep 2019
JEDEC Updates Standard for Low Power Memory Devices: LPDDR5
Feb 2019
JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard
Dec 2018
JEDEC Events: Memory Tutorials, Mobile/IOT & Automotive Forums
Feb 2018
JEDEC Updates Standards for Low Power Memory Devices
Mar 2017
JEDEC DDR5 & NVDIMM-P Standards Under Development
Mar 2017
JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard
Jan 2016
JEDEC Announces Publication of GDDR5X Graphics Memory Standard
Jan 2016
JEDEC Updates Standards for Low Power Memory Devices
Nov 2015
HGST Engineer Receives JEDEC Outstanding Leadership Award
Jul 2015
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