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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Mobile/Client/AI Computing Forum Korea
    • Server/Coud Computing/Edge Forum Korea
    • Mobile/Client/AI Computing Forum Taiwan
    • Server/Cloud Computing/Edge Forum Taiwan
    • JEDEC DDR5 Workshop: Recordings for Sale
    • Automotive Electronics Forum: Save the Date
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
    • Committee Chairs
    • Industry Collaboration
    • Policies & Governance
    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

JC-14 Recent News

JEDEC Publishes Major Update to JEP30 PartModel Guidelines May 2023
JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation Apr 2016
JEDEC and ESD Association Announce Publication of New Joint Standard for Component Level Electrostatic Discharge Sensitivity Testing – Charged Device Model Apr 2015
JEDEC and IPC Update Essential Component Assessment Standard, J-STD-020E Feb 2015
Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs Feb 2012
The ESD Association and JEDEC Publish New Revision to Standard for Electrostatic Discharge Sensitivity Testing – Human Body Model - Component Level Aug 2011
JEDEC Announces Broad Spectrum of 3D-IC Standards Development Mar 2011
JEDEC and ESD Association Announce Publication of New Joint Standard for Component Level Electrostatic Discharge Sensitivity Testing – Human Body Model May 2010
JEDEC Announces 25th Annual Reliability of Compound Semiconductors (ROCS) Workshop is Moving to MANTECH Apr 2010
NXP Engineer Receives JEDEC Technical Recognition Award Feb 2009
IPC and JEDEC Help Industry Transition to Lead Free Jan 2009
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