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Main Memory: DDR SDRAM
Mobile Memory: LPDDR, Wide I/O
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Memory Configurations: JESD21-C
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JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
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JC-64: Embedded Memory Storage & Removable Memory Cards
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Year in Review: 2023
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Members Area
Main menu
Standards & Documents
Search Standards & Documents
Recently Published Documents
Technology Focus Areas
Main Memory: DDR SDRAM
Mobile Memory: LPDDR, Wide I/O
Flash Memory: SSDs, UFS, e.MMC, XFMD
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
Lead-Free Manufacturing
Type Registration, Data Sheets
Order JEDEC Standard Manufacturer's ID Code
Order ID Code for Low Power Memories
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2024 Honorees
JEDEC Awards: Distinguished Members Recognition
In Memoriam
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
Automotive Electronics Forum
JEDEC DDR5 Workshop: Recordings for Sale
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Member List
Board of Directors
Committee Chairs
Industry Collaboration
Policies & Governance
Patent Policy
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Contact
RSS Feeds
JEDEC Staff
Website Help
Year in Review: 2023
Login required
Members Area
JC-14 Recent News
JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration
May 2024
JEDEC JC-14.7 Subcommittee Broadens Focus to Include Radio Frequency Technologies
Jan 2024
JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
Oct 2023
JEDEC Publishes Major Update to JEP30 PartModel Guidelines
May 2023
JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation
Apr 2016
JEDEC and ESD Association Announce Publication of New Joint Standard for Component Level Electrostatic Discharge Sensitivity Testing – Charged Device Model
Apr 2015
JEDEC and IPC Update Essential Component Assessment Standard, J-STD-020E
Feb 2015
Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs
Feb 2012
The ESD Association and JEDEC Publish New Revision to Standard for Electrostatic Discharge Sensitivity Testing – Human Body Model - Component Level
Aug 2011
JEDEC Announces Broad Spectrum of 3D-IC Standards Development
Mar 2011
JEDEC and ESD Association Announce Publication of New Joint Standard for Component Level Electrostatic Discharge Sensitivity Testing – Human Body Model
May 2010
JEDEC Announces 25th Annual Reliability of Compound Semiconductors (ROCS) Workshop is Moving to MANTECH
Apr 2010
NXP Engineer Receives JEDEC Technical Recognition Award
Feb 2009
IPC and JEDEC Help Industry Transition to Lead Free
Jan 2009