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Global Standards for the Microelectronics Industry
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Main Memory: DDR4 & DDR5
Mobile Memory: LPDDR, Wide I/O
Flash Memory: SSDs, UFS, e.MMC
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
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JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
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JEDEC Awards: 2020 Honorees
JEDEC Awards: Dr. Joo Sun Choi, Samsung Electronics
JEDEC Awards: Dr. Howard Yang, Montage
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Year in Review: 2020
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Members Area
Main menu
Standards & Documents
Search Standards & Documents
Recently Published Documents
Technology Focus Areas
Main Memory: DDR4 & DDR5
Mobile Memory: LPDDR, Wide I/O
Flash Memory: SSDs, UFS, e.MMC
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
Lead-Free Manufacturing
Type Registration, Data Sheets
Order JEDEC Standard Manufacturer's ID Code
Order ID Code for Low Power Memories
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2020 Honorees
JEDEC Awards: Dr. Joo Sun Choi, Samsung Electronics
JEDEC Awards: Dr. Howard Yang, Montage
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
ROCS Workshop: Papers for Sale
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Activities
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Member List
Board of Directors
Committee Chairs
Policies & Governance
Patent Policy
Contact
RSS Feeds
JEDEC Staff
Year in Review: 2020
Login required
Members Area
JC-13 Recent News
New JEDEC Standard Sets Best Practices for Mitigating Counterfeit Electronic Parts
Mar 2016
New JEDEC Subcommittee to Evaluate Technologies for Harsh Environments
Sep 2014
JEDEC Publishes New Test Standard to Measure Effects of Proton Radiation on Electronic Devices
Oct 2013
JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B)
Jun 2011
JEDEC and SAE International Join Forces to Set Fiber Optic System Test & Qualification Standards for Harsh Environment Applications
Dec 2009
JEDEC to Set Fiber Optic System Test & Qualification Standards for Harsh Environment Applications
Sep 2009