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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2020 Honorees
      • JEDEC Awards: Dr. Joo Sun Choi, Samsung Electronics
      • JEDEC Awards: Dr. Howard Yang, Montage
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • ROCS Workshop: Papers for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
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      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Member List
    • Board of Directors
    • Committee Chairs
    • Policies & Governance
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    • RSS Feeds
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    • Year in Review: 2020
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JC-13 Recent News

New JEDEC Standard Sets Best Practices for Mitigating Counterfeit Electronic Parts Mar 2016
New JEDEC Subcommittee to Evaluate Technologies for Harsh Environments Sep 2014
JEDEC Publishes New Test Standard to Measure Effects of Proton Radiation on Electronic Devices Oct 2013
JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B) Jun 2011
JEDEC and SAE International Join Forces to Set Fiber Optic System Test & Qualification Standards for Harsh Environment Applications Dec 2009
JEDEC to Set Fiber Optic System Test & Qualification Standards for Harsh Environment Applications Sep 2009
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