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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2022 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Recordings for Sale
    • Save the Dates: Mobile/Client/AI Computing Forum
    • Save the Dates: Server/Cloud Computing/Edge Forum
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
    • Committee Chairs
    • Industry Collaboration
    • Policies & Governance
    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

JC-13 Recent News

SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense Jul 2021
New JEDEC Standard Sets Best Practices for Mitigating Counterfeit Electronic Parts Mar 2016
New JEDEC Subcommittee to Evaluate Technologies for Harsh Environments Sep 2014
JEDEC Publishes New Test Standard to Measure Effects of Proton Radiation on Electronic Devices Oct 2013
JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B) Jun 2011
JEDEC and SAE International Join Forces to Set Fiber Optic System Test & Qualification Standards for Harsh Environment Applications Dec 2009
JEDEC to Set Fiber Optic System Test & Qualification Standards for Harsh Environment Applications Sep 2009
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