Global Standards for the Microelectronics Industry
Lead-Free Manufacturing
Providing Solutions to a Complex Challenge
JEDEC remains committed to helping the electronics industry define standardized solutions to meet the technological challenges posed by the migration to lead-free materials.
Spurred by a 2003 European Union directive known as RoHS (Restriction of Hazardous Substances), the industry is undergoing one of the most significant shifts in manufacturing processes to occur in the last 50 years. The transition to the use of lead-free materials has redefined reliability concerns, and created a need for solutions to challenges involving moisture sensitivity, solderability and tin whisker mitigation practices, process controls and verification testing.
JEDEC collaborated with diverse organizations, including IPC, iNEMI and ECA to ensure needed documents were created as swiftly as possible to meet industry demand.
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Recent Documents
DDR5 DIMM Labels | JESD401-5B.01 | May 2024 |
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly | J-STD-609C.01 | Apr 2024 |
Definition of “Low-Halogen” For Electronic Products | JS709D | Jan 2024 |
JOINT IPC/JEDEC Standard Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) | J-STD-020F | Dec 2022 |
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES | J-STD-033D | Apr 2018 |
SOLDERABILITY | JESD22-B102E | Oct 2007 |
MARKING, SYMBOLS, AND LABELS FOR IDENTIFICATION OF LEAD (Pb) FREE ASSEMBLIES, COMPONENTS, AND DEVICES - SUPERSEDED BY J-STD-609, August 2007 | JESD97 | May 2004 |
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JC-14 | Webex | 1 - 3 Oct 2024 |
JC-14 & JEITA | Webex | 15 - 17 Oct 2024 |
JC-14 | Tampa | 21 - 23 Jan 2025 |
JC-14.2 & JC-14.7 | Monterey | 4 Apr 2025 |
JC-14 | Minneapolis | 13 - 15 May 2025 |