JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
|Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA||MO-317B.01||Mar 2017|
|Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA||MO-321A.01||Mar 2017|
|Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA||MO-322A.01||Mar 2017|
|Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA||MO-323A.01||Mar 2017|
|Design Requirements - Fine Pitch/Fine Pitch Interstitial Ball Grid Array Packages (FBGA) and (FIBGA). (Covers body sizes ≤ 21 mm)||DR-4.5L||Mar 2017|
|Design Requirements - Fine Pitch Ball Grid Array Package (FBGA). (Covers body sizes >21mm)||DR-4.27D||Mar 2017|
|Registration - Flange Mounted Family, Surface Mount, Peripheral Terminals. R-PSFM-G.||TO-252F||Feb 2017|
|Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.||MS-034G||Jan 2017|
|Registration - Ball Grid Array Family, Rectangle, 0.75 mm Pitch||MO-328A||Jan 2017|
|Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.||MO-234C||Jan 2017|