Global Standards for the Microelectronics Industry
Flash Memory: UFS, e.MMC, SSD, XFMD
Flash Memory is the predominant storage medium in consumer electronics today, offering a wide range of non-volatile memory solutions having high density, low power usage and endurance characteristics. Flash offers low cost, high performance, and reliable storage solutions for products ranging from smartphones to IoT devices, automotive applications, notebook PCs, gaming consoles, video recording devices (drones, surveillance systems, etc.), Extended Reality (AR, VR, MR), and more.
As applications for flash have become more diverse, the need for industry standard solutions has grown. Users and suppliers are collaborating within JEDEC to define next-generation device, package and assembly standards. Current focus areas include:
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Recent Documents
Serial Flash Discoverable Parameters (SFDP) | JESD216G | Nov 2024 |
SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD | JESD218B.03 | Aug 2024 |
SPI Safety Extensions (CRC) for Non Volatile SPI Flash Memories (QPI and xSPI) | JESD255 | Mar 2024 |
XFM Device, Version 2.0 | JESD233A | Dec 2023 |
Zoned Storage for UFS | JESD220-5 | Nov 2023 |
Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension | JESD220-4 Version 1.01 | Nov 2023 |
Secure Serial Flash Bus Transactions | JESD254 | Dec 2022 |
Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension, Version 1.0 | JESD231 | Aug 2022 |
UNIVERSAL FLASH STORAGE, Version 4.0 | JESD220F | Aug 2022 |
Universal Flash Storage Host Controller Interface (UFSHCI), Version 4.0 | JESD223E | Aug 2022 |
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