Global Standards for the Microelectronics Industry
Automotive Electronics Forum Munich: Agenda
Thursday, November 14
Registered Attendee Check-in
Mian Quddus, JEDEC Board of Directors
|Automotive Electronics Trends & Memory Outlook|
Keynote Presenter: Antonio Garzon, IHS Markit
Trends in connectivity, electrification and autonomy promise to increase the amount of electronics content per car even as vehicle production levels shrink. After many years of stable heterogeneous topologies, vehicle architectures are evolving from ECU consolidation, to domain fusion and zonal gateways. The information from cameras, radars, lidars, ultrasonic modules, V2X, satellite and inertial navigation units will be pre-processed at the edge, aggregated in sensor hubs and sent to the central computer via multi-Gigabit backbone networks. ASIL-ready SoCs integrating baseband radio processors and neural processing units, microcontrollers, secure elements, reliable flash storage and high-bandwidth volatile memory will be the most important semiconductor components in ADAS sensor fusion units and digital cockpits. In the era of software-defined cars, building a high-performance “data center on wheels” with higher levels of autonomy will require redundancy, standardization, virtualization, over-the-air updates, on-demand activation of functions in the cloud, and the adoption of service-oriented architectures to decouple hardware from software in scalable, flexible and reusable designs.
|Why Memory will become a Critical CASE Linchpin in Transforming the Automotive Industry |
Keynote Presenter: MJ Cho, Samsung
Four automotive megatrends have been rapidly converging. Now, simply described as CASE (connected, autonomous, shared and electrified), these trends revolve around major advancements in electronic systems and semiconductors that will forever alter the automotive industry. For example, while “connected” is just a single word, it implies an abundance of interactions. These include how drivers interact with the electronic systems in their vehicles and control the internal electronics, as well as how vehicular systems link from car to cloud and to the rest of the outside world. We will examine how such complex interactions can be made flawless and sustainable. The complexity of realizing CASE may be beyond expectations for the foreseeable future. Though software-defined car improvements can help to accelerate CASE and streamline interactions, they might not be sufficient to free auto manufacturers from decade-old hardware platforms. Great innovations have already been introduced that are enabling cars to become one of mankind’s most important companion devices in the AI era, but that is only the beginning. Many more innovations are needed. We will examine these and discuss key considerations behind memory becoming a true focal point for the changing world of automotive electronics. The Samsung vision concentrates on what we are calling FUSE* for CASE, with FUSE underscoring the overwhelming importance of *Functional safety, Upgradability, Security for E2E protection, and Efficiency.
Applications: Infotainment and Autonomous Driving
The presentation gives insight into the requirements for automotive applications: 1) Memories in Infotainment and Autonomous Driving, 2) Mercedes-Benz view on current memory technologies, 3) Match between application and memory technology, 4) Next Gen Memory with Hypervisor support.
|Volatile and Storage Memory Solution for Future Generations' Digital Cockpit - Architecture Trends and Challenges|
Presenters: Ivan Ivanov and Krunoslav Orcic, Harman International
The current usage models in digital cockpit applications allowed use of storage device and technologies as UFS and 3D TLC NAND from the mobile eco system in the new cockpit designs, car OEMs are adding new futures /HW and applications as Images sensors used for data recording, Black box application and others. In addition to this, functionalities as connectivity / 5G is adding new sources of data, high speed data download - for movies, music and high definition maps. This is changing the STORAGE devices usage profile and creating challenge for the TBW, WAF, sustained write speed and other key parameters defining the storage devices architecture.
|Quality & Reliability in the Self-Driven Car Era|
Presenter: Alan Lucero, Intel and Nick Lycoudes, NXP
More details coming soon.
|12:00-12:30PM||MIPI in Automotive: A look at MIPI A-PHY|
Presenters: Ariel Lasry and Peter Lefkin, MIPI Alliance
Because of their key characteristics and proven performance, MIPI specifications have been deployed in billions of devices across an ever-broadening range of markets, in everything from mobile handsets, to IoT and AR/VR, to automotive. Learn how MIPI specifications for cameras (CSI-2), displays (DSI-2), sensors (I3C), storage (UniPro and M-PHY through UFS), and other functions are already being implemented in automotive. The presentation will then take a detailed look at the upcoming MIPI A-PHY specification, which will bring an eagerly-awaited solution for the "long-reach high-speed challenge" of connecting the highest speed electronic components throughout a vehicle. Get an early look at this innovative physical layer specification that works with existing MIPI specifications and others to support ADAS, autonomous driving and other surround sensor applications.
Overview of the Automotive Market and Future Challenges from Memory Perspectives
Keynote Presenters: Federico Tiziani and Giorgio Scuro, Micron
Many car buyers today care more about the infotainment technologies embedded in the dashboard than what’s under the hood. Users want to be connected and have convenient access to their personal content anywhere, anytime, on all of their devices. Their vehicles become just another node in the network, an extension of the user’s digital and social lifestyle. A “connected” car is safer, more comfortable, and more energy-efficient, equipped with early access to important information such as weather reports, traffic jams, or road accidents. Today, the automotive segment is experiencing a very high rate of innovation. The design of the traditional vehicle is changing dramatically, both during the development phase and in the use and adoption of emerging technologies. A very visible example of this trend is the use of machine learning and artificial intelligence (AI) to support the autonomous vehicle. The use of these new, emerging technologies is introducing new challenges—both in terms of safety and security; the effect is that the design and the validation of a vehicle can’t leverage only lessons learned in the past.
|2:00-2:30PM||Memory's Road Towards Reliability and Robustness for Autonomous Driving|
Presenter: Minsu Lee, SK Hynix
The demands of Autonomous vehicles are changing the supplier landscape so far driven by industry giants, with both old and new players entering cooperative partnerships to achieve the challenging goals set by automakers. Automotive systems are evolving to support autonomous driving, with stringent safety and security requirements to be met. Memory is one of the key enablers for Autonomous Driving. Achieving the next level of automation, infotainment, and connectivity requires computational power, which can be delivered by Memory’s bandwidth and capacity. More than one million lives are lost each year in traffic-related accidents. However, in the near future, Autonomous driving and diverse safety features will dramatically cut that number for sure. To raise the quality and reliability of the driving experience in automobiles of the future, SK hynix, as a proven memory partner, is striving to obtain robust qualification beyond AEC_Q100, while considering and reflecting customers’ requirements. This session will talk about SK hynix’s Automotive readiness and how we are preparing automotive DRAM solutions, all equipped with high quality and reliability.
|2:30-3:00PM||Removing Roadblocks for AVs|
Presenter: Martin Duncan, STMicroelectronics
The complexity of the requirements for automotive applications is increasing at an astonishing pace, none more so than autonomous driving. The acceleration driven by advancing global safety standards (NCAP) calls for a lot more than just a rigorous step by step approach. The functional safety of systems, products and processes increases with every day and with every new development and we must maintain a grasp of the risks during every phase: from the first concept through development and from operation through shutdown. With the increased connectivity and complexity there are serious security challenges for the design of automotive hardware/software architectures due to attacks. With the immense processing power that is being unlocked with multi-processor systems we are now able to address complex issues such as a complete inspection of the vehicle’s environment. In this paper we will discuss the challenges of implementing a safe, secure, complex driver assistance system that paves the way towards autonomous driving.
|3:15-3:45PM||Driving Into the Memory Wall - The Role of Memory for Advanced Driver Assistance Systems and Autonomous Driving|
Presenter: Dr. Matthias Jung, Fraunhofer IESE Institute
Autonomous driving is disrupting conventional automotive development. Underlying reasons include control unit consolidation, the use of components originally developed for the consumer market, and the large amount of data that must be processed. For instance, Audi's zFAS or NVIDIA's Xavier platform integrate GPUs, custom accelerators, and CPUs within a single domain controller to perform sensor fusion, processing, and decision making. The communication between these heterogeneous components and the algorithms for Advanced Driver Assistance Systems and Autonomous Driving require low latency and huge memory bandwidth, bringing the Memory Wall from high-performance computing in data centers directly to our cars. In this talk I will discuss these and other requirements in using DRAM for near-term autonomous driving architectures.
|3:45-4:15PM||Bringing NVRAM Persistent Memory into the Automotive Sphere|
Presenter: Bill Gervasi, Nantero
Remember when cars were mechanical devices instead of computers on wheels? The rapidly growing requirements for smarter cars, leading to the self driving vehicles of the future, are having a ripple effect through the memory industry to address these new requirements. NVRAM is an emerging technology that combines the speed of DRAM with non-volatility to provide new levels of performance and capability to the automotive market. NVRAM provides the high performance needed to meet the combination of requirements such as communications, entertainment, artificial intelligence, and to cope with the wide array of sensor data processing. NVRAM also addresses many of the environmental needs for temperature, shock, and vibration that are driven by this market segment.
|4:15-4:45PM||Advances in Wide Bandgap Semiconductor Technology and Industry Support of Standardization|
Presenter: Perry Keller, Keysight
At the 2016 JEDEC Automotive Forum auto manufacturers, Tier 1 suppliers, and others in the automotive industry expressed an urgent need for clear technical and applications information for Wide Bandgap power semiconductors. This included even definition of fundamental operating parameters, measurement procedures, and accurate simulation models. Since then, the major GaN and SiC suppliers have begun to work on standards that will address these issues and accelerate the already explosive growth in use of WBG power devices and modules. Simultaneously, rapid advances in reliability, performance, and understanding how to apply WBG technology is enabling the solution of what used to be considered impossible problems. This session will explain how JEDEC and the WBG industry heard and responded to the call to action, how WBG users can benefit from and get directly involved in the standardization activities, and describe the key advances in WBG technology that helped make this all possible.
|4:45-5:15PM||Automotive Market Trends and Memory Challenge|
Presenter: Brian Pluckebaum, Telechips
Problem: The Automotive design cycles continue to be shortened. Defining the best performance & cost solution is becoming an even greater concern as requirements differ greatly from one OEM to the next. Addressing: OEM / Tier 1 concerns: price performance to handle an ever changing requirements and cost of design changes. Additionally, OEM to OEM the requirements are diverging creating a more difficult environment for SoC vendors to define the optimum memory solution (performance and cost). We will discuss the types of memory required for difficult aspect ratios, multiple screens, ever increasing 4K & 5K content, multiple camera inputs, ADAS, CNN, etc.
Program, topics and speakers subject to change without notice.