Year in Review: 2024

Thousands of dedicated volunteers representing over 360 member companies helped JEDEC serve the industry in 2024 and contributed to a year filled with both new and ongoing initiatives.

Standards and Publications

JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface, wide bandgap, and more. In 2024, JEDEC published 7 new standards, 3 new publications, 2 joint standards, 31 registration outlines, 1 memory device specification, and 1 memory module design file registration. An additional 30 standards and publications received updates. See a complete listing of standards and documents recently published by JEDEC.

Events

In May 2024 JEDEC held Mobile/Client/AI Computing and Server/Cloud Computing/Edge Forums in San Jose, CA. An Automotive Forum was also held in San Jose, CA in September. Joint webinars were held with the MIPI® Alliance in February and the OCP in June. In addition, 27 committee meetings were held during the year.

China

In 2024, the number of member companies in mainland China (including Hong Kong) experienced a 7% increase, rising from 69 in 2023 to 74. This represents 19% of the total JEDEC membership. Despite ongoing geopolitical challenges, membership growth from mainland China and other Asian countries is anticipated to continue over the next five years, driven by the expanding semiconductor industry throughout the region.

JEDEC supported Flash Memory World in Nanjing, China, held on August 28, 2024. JEDEC is actively working to engage TC599, a newly established technical committee dedicated to semiconductor standardization in China. This collaboration aims to harmonize standardization procedures between the two organizations and prevent fragmentation of standards within the global semiconductor industry.

Industry Collaboration

During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities in 2024 included:

  • CTA: JEDEC was an Allied Association for CES 2024.
  • DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
  • ECIA: JEDEC and ECIA are planning a joint task group effort to expand the scope of JESD50 which will become JS-050.
  • ECIA and IPC: Work continues with JEDEC, ECIA and IPC on revisions of J-STD-046, J-STD-048, and J-STD-075.
  • ECLASS: ECLASS and JEDEC developed an MOU to facilitate alignment of the ECLASS Standard with JEP30 PartModel Guidelines.
  • ESDA: JEDEC and ESDA have several ongoing collaborative projects related to ESD, including recent updates to joint standards JS-001-2024 and JS-002-2022, JTR-001 and Bare Die TR.
  • Industry Council on ESD: Work on multiple white papers continues and these will be balloted in the near future. JEP196 was approved and published.
  • IEC: Introduced MOUs for requirements, tests and data schemas for harmonization/driving of JEDEC standards into IEC.
  • IPC: JEDEC and IPC continued their longstanding collaboration on standards for quality and reliability with JEDEC acting as the lead organization for revision of IPC/JEDEC 9702, 9703, 9706, and J-STD-033.
  • JEITA: JEDEC continues its partnership with JEITA with annual joint meetings to drive international standards harmonization. This year a virtual session was held in October 2024.
  • MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer.
  • NIST: JC-13 continues to receive NIST participation and support for its IGA and Wirebond task groups.
  • OCP: The alliance between the Open Compute Project Foundation (OCP) and JEDEC to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification as part of JEDEC’s JEP30: PartModel Guidelines continued with ongoing updates to JEP30 throughout the year.
  • SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.
  • SNIA: JEDEC and SNIA entered into an agreement to facilitate alignment related to CXL Memory Modules and JC-64.8 activities.
  • TC599: JEDEC and TC599, a newly established technical committee dedicated to semiconductor standardization in China, signed an agreement with the goal of harmonizing standardization procedures between the two organizations.

For more information on JEDEC’s industry collaborations click here.

Member Thank You

JEDEC is grateful for your active participation and support of open industry standards and the standards development process.

JEDEC is committed to serving you, your company and the industry. If you have any questions about your membership or need assistance, please contact Ms. Arlene Collier at (703) 907-7534 or arlenec@jedec.org.

Resources (handouts)

Here are resources to help you explain the value of open industry standards and JEDEC participation:

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