Thousands of dedicated volunteers representing nearly 300 member companies helped JEDEC serve the industry in 2016, and contributed to a year filled with both new and ongoing initiatives:
JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface. In 2016, JEDEC published 18 complete standards, 4 publications, 2 joint standards, 22 registered outlines, 3 design guides, 8 memory device specifications, and 6 Memory Module Design File Registrations, including the following:
JEDEC also published the following notable updates to previously existing standards:
JEDEC hosted a series of successful Mobile and IOT Forums in Shanghai, China; Seoul, Korea (in partnership with KSIA) and Hsinchu, Taiwan (in partnership with TSIA). The 31st annual Reliability of Compound Semiconductors (ROCS) Workshop was held in Miami, FL in May.
The inaugural JEDEC-wide meeting was held in June in New Orleans, LA, which provided JEDEC members with networking opportunities and the convenience of having all committee meetings in one location.
As a result of the rapid development of both the semiconductor and ICT industries in China, JEDEC standards have attracted more and more attention. The most significant development for JEDEC in China in 2016 has been the establishment of the JC-14 China TG, which was initiated by member company Huawei. Three TG meetings were held in 2016, with approximately 40 attendees at each meeting. This TG serves the purpose of helping local Chinese companies become familiar with JEDEC organization, procedures and standards through an exchange of information among members and non-members, technical discussions and education.
This year has also seen an increased level of active participation in JEDEC committees by Chinese companies held in the United States, including the introduction of standards proposals.
The Marketing and Communications Department was very active this year in the promotion of JEDEC’s events and major standards announcements, resulting in prominent coverage in major industry publications. The department also continued a partnership with SmartBrief to ensure the continued popularity of the JEDEC SmartBrief daily email newsletter, providing increased awareness for the JEDEC brand, standards and ongoing activities. Subscribe today.
In support of industry interest in developing standards for wide bandgap semiconductors, JEDEC was a Ruby sponsor of the WiPDA conference in Fayetteville, Arkansas in November.
During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities include:
JEDEC is grateful for your active participation and support of open industry standards and the standards development process.
JEDEC is committed to serving you, your company and the industry. If you have any questions about your membership or need assistance, please contact Ms. Arlene Collier at (703) 907-7534 or email@example.com.
As a JEDEC member, your company will join nearly 300 leading industry companies driving the development of open standards for the global microelectronics industry. JEDEC member companies are represented in standards development activities by over 3,000 dedicated volunteers participating in 50 JEDEC committees.
JEDEC member companies enjoy many benefits, including valuable access to pre-publication materials and proposals that put them ahead of the competition. Find out more and apply online.