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PREPARATION OF OUTLINE DRAWINGS OF SOLID-STATE PRODUCTS FOR JEDEC TYPE REGISTRATION, RESCINDED May 2009Status: Rescinded
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EIA308-A |
Aug 1981 |
Note that the terms and definitions contained in EIA308A are still available in the JEDEC dictionary as they are commonly used in the industry.
Committee(s):
JC-11
Download EIA308-A Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.
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MO-285-A |
Aug 2007 |
Item 11.11-760 and 11.11-760(E)
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-285-A Free download. Registration or login required. |
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Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.
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MO-284-A |
May 2007 |
Item 11.11-755 Patent(s): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-284-A Free download. Registration or login required. |
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Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.
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MO-286-A |
Jan 2007 |
Item 11.11-771
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-286-A Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.
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MO-287-A |
Sep 2007 |
Item 11.11-777
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-287-A Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.
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MO-288-B |
Sep 2009 |
Item 11.11-821
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-288-B Free download. Registration or login required. |
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Registration - DDR3 DIMM Connector Insertion Force Gauge. Item 11.14-110.
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GS-008-A |
Oct 2007 |
Committee(s):
JC-11 JEP95 Registrations Main Page
Download GS-008-A Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.
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MO-291-B |
Dec 2008 |
Item 11.11-805 Patent(s): Amkor: 6818973; 7211471
Committee(s):
JC-11 JEP95 Registrations Main Page
Download MO-291-B Free download. Registration or login required. |
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Registration - DDR3 DIMM 240 Pin SMT Soclket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123
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SO-014A |
Jul 2008 |
Committee(s):
JC-11 JEP95 Registrations Main Page
Download SO-014A Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.
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MO-294-A |
Nov 2008 |
Item 11.11-804
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-294-A Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.
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MO-273C |
Mar 2011 |
Item 11.11-841
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-273C Free download. Registration or login required. |
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Registration - Plastic Surface Mounted Header Family. R-PSFM-F. Item 11.10-447.
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TO-279B |
Aug 2008 |
Committee(s):
JC-11, JC-11.10 JEP95 Registrations Main Page
Download TO-279B Free download. Registration or login required. |
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Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.
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MO-270-B |
Jun 2008 |
Item 11.11-790 Patent(s): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Download MO-270-B Free download. Registration or login required. |
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Registration - Thin profile, Plastic Small Outline, Surface Mount. T-PSOF. Item 11.10-437.
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DO-221A |
May 2006 |
Committee(s):
JC-11, JC-11.10 JEP95 Registrations Main Page
Download DO-221A Free download. Registration or login required. |
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Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.
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DO-222A |
May 2006 |
Committee(s):
JC-11, JC-11.10 JEP95 Registrations Main Page
Download DO-222A Free download. Registration or login required. |
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Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers.
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MO-282-A |
Jan 2007 |
Item 11.14-099 Patent(s): STAKTEK: See Outline
Committee(s):
JC-11 JEP95 Registrations Main Page
Download MO-282-A Free download. Registration or login required. |
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Registration - 144 Pin, DDR/DDR2 16b/32b Small Outline Module, Dual Inline Memory Module (SODIMM) Family. 0.8 mm Lead Centers, Dual Notch, Socket Outline.
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SO-008A |
Oct 2006 |
Item 11.14-090
Committee(s):
JC-11 JEP95 Registrations Main Page
Download SO-008A Free download. Registration or login required. |
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Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
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SO-009A |
Feb 2007 |
Committee(s):
JC-11 JEP95 Registrations Main Page
Download SO-009A Free download. Registration or login required. |
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Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.
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MO-283-B |
Jan 2008 |
Item 11.4-782 Patent(s): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT).
Committee(s):
JC-11, JC-11.4, JC-65 JEP95 Registrations Main Page
Download MO-283-B Free download. Registration or login required. |
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Design Guideline - Internal Stacking Module, Land Grid Array Packages with External Interconnect Terminals (ISM).
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DG-4.21A |
Feb 2007 |
Item 11.2-699(S)
Committee(s):
JC-11 JEP95 Registrations Main Page
Download DG-4.21A Free download. Registration or login required. |
