Standards & Documents Search: JC-13: Government Liaison

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Title	Document #	Date
STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS, Reaffirmed September 2003. RESCINDED October 2008Status: Rescinded October 2008	JESD390A	Feb 1981
Committee(s): JC-13.2, JC-13 Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORSStatus: Rescinded May 2006	EIA623	Jul 1994
Committee(s): JC-13 Free download. Registration or login required.
JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS: RESCINDED, May 2006Status: Rescinded May 2006	JEP101-C	Nov 1995
Committee(s): JC-13.2 Free download. Registration or login required.
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP105	Apr 1983
Committee(s): JC-13.5 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP107	Apr 1985
Committee(s): JC-13.5 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:Status: Rescinded	JEP109-C	Mar 1995
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP112	Jun 1987
Committee(s): JC-13 Free download. Registration or login required.
GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION:	JEP114.01	Oct 2007
This publication was developed to help the user of this test methodology avoid common interference ∆s to successful application. The guide contains sections on typical specification requirements, sources of particles, PIND test systems, calibration, maintenance, test interference's, operator training, particle recovery and failure analysis. Application of the information contained in the guide will improve the quality and affectivity for any PIND testing operation. Committee(s): JC-13.5, JC-13 Free download. Registration or login required.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:	JEP121A	Oct 2006
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee(s): JC-13.2, JC-13 Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE:Status: Reaffirmed September 2003, January 2007	JEP132	Jul 1998
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. In December 2004 the document was renumbered to conform with JM7, JEDEC Style Manual. Committee(s): JC-13 Free download. Registration or login required.
GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:	JEP133C	Jan 2010
A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500. Committee(s): JC-13.4, JC-13.5 Free download. Registration or login required.
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)Status: Reaffirmed September 2008	JESD16-A	Apr 1995
This standard was revised to clarify assumptions necessary to estimate AOQ, revise the minimum sample size algorithm, address small sample size concerns, and provide methods for combining groups for AOQ estimation. Derivation of any new methods for combing groups for AOQ estimation. Derivation of any new methods introduced into this document have been provided in annexes. A statistical method is based on confidence interval statistics. A procedure was established for reporting AOQ when the minimum sample size criterion is not met. Not all sections of EIA-554 are appropriate for use by device manufacturers therefore JEDEC wishes to continue using JESD16A. In December 2008 the formulating committee approved to remove EIA-554 (July 1996, Reaffirmed September 2002) from the JEDEC website. To obtain a copy of EIA-554 please contact GEIA at http://www.geia.org/ Committee(s): JC-13 Free download. Registration or login required.
GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-AStatus: Rescinded	JESD19	Jul 1988
Committee(s): JC-13 Free download. Registration or login required.
GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001Status: Rescinded	JESD26-A	Apr 1990
Committee(s): JC-13.2 Free download. Registration or login required.
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGESStatus: Rescinded May 2011, Superseded by JESD9B, May 2011	JESD27	Aug 1993
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance. Committee(s): JC-13.5, JC-13 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES	JESD31D.01	Sep 2012
This publication identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this publication are only applicable to products for which ownership remains with the Distributor or Manufacturer. Committee(s): JC-14.4, JC-13 Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994Status: Superseded	JESD40	Jul 1994
Committee(s): JC-13 Free download. Registration or login required.
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994.Status: Superseded	JESD42	Mar 1994
Committee(s): JC-13 Free download. Registration or login required.
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD):Status: Reaffirmed January 2009	JESD49A	Sep 2005
This standard was created to facilitate the procurement and use of high reliability semiconductor microcircuits or discrete devices provided in bare die form, commonly known as Known Good Die (KGD). Committee(s): JC-13 Free download. Registration or login required.
MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002Status: Rescinded October 2002	JESD53	Jan 1996
Committee(s): JC-13.2, JC-13 Free download. Registration or login required.

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