Standards & Documents Search: JC-13: Government Liaison

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Title	Document #	Date
STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS, Reaffirmed September 2003. RESCINDED October 2008Status: Rescinded October 2008	JESD390A	Feb 1981
Committee(s): JC-13.2, JC-13 Download JESD390A Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORSStatus: Rescinded May 2006	EIA623	Jul 1994
Committee(s): JC-13 Download EIA623 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:Status: Rescinded	JEP109-C	Mar 1995
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Download JEP109-C Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP112	Jun 1987
Committee(s): JC-13 Download JEP112 Free download. Registration or login required.
GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION:	JEP114.01	Oct 2007
This publication was developed to help the user of this test methodology avoid common interference ∆s to successful application. The guide contains sections on typical specification requirements, sources of particles, PIND test systems, calibration, maintenance, test interference's, operator training, particle recovery and failure analysis. Application of the information contained in the guide will improve the quality and affectivity for any PIND testing operation. Committee(s): JC-13.5, JC-13 Download JEP114.01 Free download. Registration or login required.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:	JEP121A	Oct 2006
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee(s): JC-13.2, JC-13 Download JEP121A Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE:Status: Reaffirmed September 2003, January 2007	JEP132	Jul 1998
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. In December 2004 the document was renumbered to conform with JM7, JEDEC Style Manual. Committee(s): JC-13 Download JEP132 Free download. Registration or login required.
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM):Status: Reaffirmed September 2008	JESD16-A	Apr 1995
This standard was revised to clarify assumptions necessary to estimate AOQ, revise the minimum sample size algorithm, address small sample size concerns, and provide methods for combining groups for AOQ estimation. Derivation of any new methods for combing groups for AOQ estimation. Derivation of any new methods introduced into this document have been provided in annexes. A statistical method is based on confidence interval statistics. A procedure was established for reporting AOQ when the minimum sample size criterion is not met. Not all sections of EIA-554 are appropriate for use by device manufacturers therefore JEDEC wishes to continue using JESD16A. In December 2008 the formulating committee approved to remove EIA-554 (July 1996, Reaffirmed September 2002) from the JEDEC website. To obtain a copy of EIA-554 please contact GEIA at http://www.geia.org/ Committee(s): JC-13 Download JESD16-A Free download. Registration or login required.
GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-AStatus: Rescinded	JESD19	Jul 1988
Committee(s): JC-13 Download JESD19 Free download. Registration or login required.
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGESStatus: Rescinded May 2011, Superseded by JESD9B, May 2011	JESD27	Aug 1993
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance. Committee(s): JC-13.5, JC-13 Download JESD27 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES	JESD31D	Sep 2010
This publication identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this publication are only applicable to products for which ownership remains with the Distributor or Manufacturer. Committee(s): JC-14.4, JC-13 Download JESD31D Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994Status: Superseded	JESD40	Jul 1994
Committee(s): JC-13 Download JESD40 Free download. Registration or login required.
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994.Status: Superseded	JESD42	Mar 1994
Committee(s): JC-13 Download JESD42 Free download. Registration or login required.
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD):Status: Reaffirmed January 2009	JESD49A	Sep 2005
This standard was created to facilitate the procurement and use of high reliability semiconductor microcircuits or discrete devices provided in bare die form, commonly known as Known Good Die (KGD). Committee(s): JC-13 Download JESD49A Free download. Registration or login required.
MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002Status: Rescinded October 2002	JESD53	Jan 1996
Committee(s): JC-13.2, JC-13 Download JESD53 Free download. Registration or login required.
INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS	JESD9B	May 2011
The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: External Visual. Committee(s): JC-13.5, JC-13 Download JESD9B Free download. Registration or login required.
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES	JESD625B	Dec 2011
This standard establishes the minimum requirements for Electrostatic Discharge (ESD) control methods and materials used to protect electronic devices that are susceptible to damage or degradation from electrostatic discharge (ESD). The passage of a static charge through an electrostatic-discharge-sensitive (ESDS) device can result in catastrophic failure or performance degradation of the part. Committee(s): JC-14.1, JC-13 Download JESD625B Free download. Registration or login required.
MEASUREMENT AND REPORTING OF ALPHA PARTICLE AND TERRESTRIAL COSMIC RAY INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICES:	JESD89A	Oct 2006
This specification defines the standard requirements and procedures for terrestrial soft-error-rate (SER) testing of integrated circuits and reporting of results. Both real-time (unaccelerated) and accelerated testing procedures are described. At terrestrial, Earth-based altitudes, the predominant sources of radiation include both cosmic-ray radiation and alpha-particle radiation from radioisotopic impurities in the package and chip materials. An overall assessment of a deviceís SER is complete, only when an unaccelerated test is done, or accelerated SER data for the alpha-particle component and the cosmic-radiation component has been obtained. Committee(s): JC-13.4, JC-13 Download JESD89A Free download. Registration or login required.
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS:Status: Reaffirmed September 2009	JEP142	May 2002
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Committee(s): JC-13.5, JC-13 Download JEP142 Free download. Registration or login required.
GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES	JEP144A	Nov 2011
This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. Committee(s): JC-13 Download JEP144A Free download. Registration or login required.

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