Standards & Documents Search: JC-11: Mechanical (Package Outlines) Standardization

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Title	Document #	Date
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch Item No. 11.11-857	MO-303B	Mar 2012
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA Item 11.11-853	MO-308A	Apr 2012
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Registration - Fine Pitch Thick Square Ball Grid Array Package (BF-BGA) Item 11.11-852(R)	DR-4.27A	Apr 2012
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).	DR-4.6D.01	Jul 2012
Item 11.2-838(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.	MO-244D	Jul 2012
Item No. 14-136 Patent(s): Hitachi: 5,227,664 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patent(s): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Lead Centers. DIM	MO-268D	Aug 2012
Item 11.14-135, 11.14-139 Patent(s): Hatachi: 5,227,664 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 284 Pin DDR4 DIMM, 0.85 mm Pitch. DIM Item No. 11.14-144	MO-309A	Aug 2012
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 256 Pin, DDR4 SODIMM and GDDR5M Outline, 0.50mm Pitch. DIM Item No. 11.14-146, includes Editorial correction	MO-310A.01	Sep 2012
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM SMT, 284 Pin Socket Outline, 0.85 mm Pitch. SKT Item No. 14-143	SO-017A	Sep 2012
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.	SO-008B	Oct 2012
Item 11.14-141 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Standard, Low, Thin, and Very Thin Profile, Rectangular Fine Pitch Ball Grid Array Family, 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.	MO-276G	Oct 2012
Item 11.11-866 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM PTH 284 Pin Socket Outline, 0.85 mm Pitch. SKT Item No. 14-142(E)	SO-016A.01	Oct 2012
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, Very Thin Profile, Rectangular Fine Pitch, Ball Grid Array Package, 0.80 mm X 0.65 mm Pitch. VFR-XBGA Item No. 11-867	MO-311A	Oct 2012
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 and GDDR5M Small Outline Dual Inline Memory Module (SODIMM), 256 pin, 0.50mm pitch Socket Outline Item No. 14-145	SO-018A	Oct 2012
Patent(s): Foxconn: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIM	MO-274C	Dec 2012
Item 11.14-150 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.	MO-269H	Dec 2012
Item 11.14-134 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - DDR4 DIMM Press Fit 284 Pin Socket Outline, 0.85 mm Pitch. SKT Item 14-147	SO-019A	Dec 2012
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors	SPP-023B	Feb 2013
Item 11.11-781(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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