Standards & Documents Search: JC-11: Mechanical (Package Outlines) Standardization

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Title	Document #	Date
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin DDR2 DIMM 1.00 mm Contact Centers, Press Fit Socket Outline. Item 11.14-111	SO-011A	Sep 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin DDR3 DIMM 1.00 mm Contact Centers, Press Fit Socket Outline.	SO-012A	Sep 2007
Item 11.14-112 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin FBDIMM 1.00 mm Contact Centers, Press Fit Socket Outline. SKT. Item 11.14-113	SO-013A	Sep 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 DIMM Connector Insertion Force Gauge. Item 11.14-110.	GS-008-A	Oct 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 2, 4, and 6 Lead Screw Mount Power Package. PDFP-(C, F, G). Item 11.10-444.	TO-272-C	Oct 2007
Committee(s): JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 204 Pin SO-DDR3 SDRAM, 0.60 mm Contact Centers, Socket Outline.	SO-006B	Oct 2007
Item 11.14-114 Patent(s): Foxconn (Hon Hai): 5,882,211, 6,113,398 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Performance Standard - 240 Pin DDR3, UDIMM. Item 11.14-109(S)	PS-001A	Oct 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers	MO-290-A	Nov 2007
Item 11.14-118 Patent(s): STAKTEK, See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.	MO-283-B	Jan 2008
Item 11.4-782 Patent(s): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT). Committee(s): JC-11, JC-11.4, JC-65 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787	MO-253-B	Feb 2008
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.	MO-270-B	Jun 2008
Item 11.11-790 Patent(s): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 DIMM 240 Pin SMT Soclket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123	SO-014A	Jul 2008
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446.	TO-270C	Jul 2008
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array (BGA)Package Measuring and Methodology.	DG-4.17C	Jul 2008
Item 11.2-791(S) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Surface Mounted Header Family. R-PSFM-F. Item 11.10-447.	TO-279B	Aug 2008
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Small Outline (SO) Family Peripheral Terminals, 1.27 mm Pitch, 3.90 mm Body Width (Mold Flash and End Protrusion). R-PDSO/SOP/SOIC. Item 11.11-801(s).	MS-012F	Aug 2008
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.	MO-242-C	Sep 2008
Item 11.4-800 Patent(s): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 DIMM 240 Position Socket Outline, 1.00 mm Contact centers	SO-007B	Sep 2008
Item 11.14-119 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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