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Standards & Documents Search: JC-11: Mechanical (Package Outlines) Standardization
Results 421 - 440 of 545
Results
Title |
Document # | Date |
|---|---|---|
| Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299. | MO-130-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. | MO-129-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. | MO-131-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264. | MO-090-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Tray for Handling and Shipping of Metric Quad Flatpack (QFP) Packages. Variations AA-AE. Item 11.5-298/336. | CO-012-C | Nov 1992 |
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Free download. Registration or login required. |
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| Registration - Tray for Handling and Shipping of PGA Packages. Item 11.5-382 | CO-010-E | Nov 1994 |
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Free download. Registration or login required. |
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| Registration - Tray for Handling and Shipping of PQFP Packages, 52, 68, 84, 100, 132, 164, 196 and 244 Pins. Variations AA-AG. Item 11.5-249 | CO-015-B | Jan 1993 |
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Free download. Registration or login required. |
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| Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426. | MO-183-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - TSOP I, 7.62 mm Body. Item 11.11-346. | MO-132-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. | MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Update of AC Configuration - Leadless Family. Item 11.10-240. | DO-213-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA. | MO-273C | Mar 2011 |
Item 11.11-841 Free download. Registration or login required. |
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| Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319. | MO-141-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. | MO-202-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. | MO-292C | Apr 2010 |
Item 11.11-824 Patent(s): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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| Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. | MO-291-B | Dec 2008 |
Item 11.11-805 Patent(s): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |
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| Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA. | MO-222-B.01 | Dec 2010 |
Item 11.11-803, 11.11-842E Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA. | MO-294-A | Nov 2008 |
Item 11.11-804 Free download. Registration or login required. |
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| Registration - Very Thin, Fine-Pitch, Fully Overmolded, Stackable, Ball Grid Array Family, 0.40 mm Ball Pitch. VF-XBGA. Item 11.11-813 | MO-302A | Apr 2010 |
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Free download. Registration or login required. |
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| Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA. | MO-285-A | Aug 2007 |
Item 11.11-760 and 11.11-760(E) Free download. Registration or login required. |
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: all » JC-11: Mechanical (Package Outlines) StandardizationDocument Type
- CO- (Carrier Outlines) (35)
- CS- (Carrier Standards) (8)
- DG- (Design Guideline) (14)
- DO- (Diode Outlines) (19)
- DR- (Design Registration) (9)
- EIA (EIA Standards) (1)
- GS- (Gauge Standards) (9)
- JEB (JEDEC Engineering Bulletins) (1)
- JEP (JEDEC Publications) (4)
- JESD (JEDEC Standards) (2)
- MO- (Microelectronic Outlines) (305)
- MS- (Microelectronic Standards) (34)
- PS- (Performance Standards) (1)
- SO- (Socket Outlines) (18)
- SPP- (Standard Practices and Procedures) (24)
- TO- (Transistor Outlines) (53)
- TS- (Transistor Standards) (5)
- UO- (Uncased Outlines) (2)
- US- (Uncased Standards) (1)
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