- Home
- About JEDEC
- Standards & Documents
- Committees
- JC-10: Terms, Definitions, and Symbols
- JC-11: Mechanical (Package Outlines) Standardization
- JC-13: Government Liaison
- JC-14: Quality and Reliability of Solid State Products
- JC-15: Thermal Characterization Techniques for Semiconductor Packages
- JC-16: Interface Technology
- JC-22: Diodes and Thyristors
- JC-25: Transistors
- JC-40: Digital Logic
- JC-42: Solid State Memories
- JC-45: DRAM Modules
- JC-63: Multiple Chip Packages
- JC-64: Embedded Memory Storage and Removable Memory Cards
- JC-65: RFID
- News
- Events & Meetings
- Join JEDEC
- Members Area
- Order JEP 95 and JESD21-C Related Products
- Privacy Policy
Standards & Documents Search: JC-11: Mechanical (Package Outlines) Standardization
Results 61 - 80 of 545
Results
| Title | Document # |
Date |
|---|---|---|
| Registration - Single-In-Line (SIP) Family. Item 11.3-79. | MO-035-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388. | MO-036-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S. | MO-037-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing. | MO-038-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing. | MO-039-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Power Module. Recission of Variation AB. | MO-040-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. | MO-041-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101. | MO-042-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143. | MO-043-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. | MO-044-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Single-In-Line Power Module. Item 11.3-128. | MO-045-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147. | MO-046-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242. | MO-047-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205. | MO-048-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular). | MO-052-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133. | MO-054-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207. | MO-055-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. | MO-056-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124 | MO-057-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385). | MO-058-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
User login
Current search
[×]
Committees
: JC-11: Mechanical (Package Outlines) StandardizationSearch by Keyword or Document Number
Guided search
Click a term to refine your current search.
Committees
: all » JC-11: Mechanical (Package Outlines) StandardizationDocument Type
- CO- (Carrier Outlines) (35)
- CS- (Carrier Standards) (8)
- DG- (Design Guideline) (14)
- DO- (Diode Outlines) (19)
- DR- (Design Registration) (9)
- EIA (EIA Standards) (1)
- GS- (Gauge Standards) (9)
- JEB (JEDEC Engineering Bulletins) (1)
- JEP (JEDEC Publications) (4)
- JESD (JEDEC Standards) (2)
- MO- (Microelectronic Outlines) (305)
- MS- (Microelectronic Standards) (34)
- PS- (Performance Standards) (1)
- SO- (Socket Outlines) (18)
- SPP- (Standard Practices and Procedures) (24)
- TO- (Transistor Outlines) (53)
- TS- (Transistor Standards) (5)
- UO- (Uncased Outlines) (2)
- US- (Uncased Standards) (1)
Standards and Documents Assistance
Contact Julie Carlson, 703-624-9230