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Standards & Documents Search: JC-63: Multiple Chip Package
4 results
Results
| Title |
Document # |
Date |
|---|---|---|
| MCP Overview | MCP3_12_00 | Jun 2006 |
Release No. 16 Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
| Multichip Packages (MCP) Configurations | MCP3_12_01 | Jun 2010 |
Release No. 20A. Item UI3406, 43.02, UI38.24d, UI49.00, 33.03, 51.02 Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
| Package-on-Package (PoP) and Internal Stacked Module (ISM) | MCP3_12_02 | Apr 2010 |
Release No. 20. Item 48.18, 48.24, 48.26, 38.21b, 48.06a, 38.26 Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
| Silicon Pad Sequence (x16/x32 LPDRAM, x16 PSRAM, x16 NAND). Item JC-63-029 | MCP3_12_03 | Nov 2006 |
Release No. 16A Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
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