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Standards & Documents Search: JC-15: Thermal Characterization Techniques for Semiconductor Packages, Forced Convection (Moving Air)
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| Title |
Document # |
Date |
|---|---|---|
| INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR): | JESD51- 6 | Mar 1999 |
This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test board. Committee(s): JC-15.1 Free download. Registration or login required. |
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