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Standards & Documents Search: JC-14.4: Quality Processes and Methods, Lead-Free Manufacturing
3 results
Results
| Title | Document # | Date |
|---|---|---|
| MARKING, SYMBOLS, AND LABELS FOR IDENTIFICATION OF LEAD (Pb) FREE ASSEMBLIES, COMPONENTS, AND DEVICES - SUPERSEDED BY J-STD-609, August 2007Status: Superseded by J-STD-609, August 2007 | JESD97 | May 2004 |
Committee(s): JC-14.1, JC-14.4 Free download. Registration or login required. |
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| MARKING AND LABELING OF COMPONENTS, PCBs AND PCBAs TO IDENTIFY LEAD (Pb), Pb-FREE AND OTHER ATTRIBUTES | J-STD-609A.01 | Feb 2011 |
This standard applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This standard documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This standard applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs). Material and their containers previously marked or labeled according to JESD 97 or IPC-1066 need not be remarked unless agreed upon by the supplier and customer. Free download. Registration or login required. |
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| JOINT JEDEC/ECA STANDARD, DEFINING “LOW-HALOGEN” ELECTRONIC PRODUCTS (REMOVAL OF BFR/CFR/PVC) This document replaces JEP709 and JS709. | JS709A | May 2012 |
This standard provides terms and definitions for "low-halogen" electronic products that have the potential to contain the halogens Br and Cl from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling. Free download. Registration or login required. |
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