Standards & Documents Search: JC-14: Quality and Reliability of Solid State Products, Lead-Free Manufacturing

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Title	Document #	Date
JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES	J-STD-020D.1	Mar 2008
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. It is used to determine what classification level should be used for initial reliability qualification. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. This revision now covers components to be processed at higher temperatures for lead-free assembly. A hard cop version is available for $20 each for IPC/JEDEC members and $40 for nonmembers. Committee(s): JC-14.1, JC-14 Download J-STD-020D.1 Free download. Registration or login required.
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES (Available in German, www.ihs.com)	J-STD-033C	Jan 2012
NOTE - The Moisture Sensitive Caution Label (figure 3-4) has been editorially revised since originally posted 11/04/05, if you downloaded this file prior to 12/14/05 please download this revised version This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. Now updated to support components that may need to be processed at higher temperatures, such as lead-free processes, these methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. IPC/JEDEC J-STD-033C helps achieve safe and damage-free reflow with the dry packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags. Committee(s): JC-14.1, JC-14 Download J-STD-033C Free download. Registration or login required.
MARKING AND LABELING OF COMPONENTS, PCBs AND PCBAs TO IDENTIFY LEAD (Pb), Pb-FREE AND OTHER ATTRIBUTES	J-STD-609A.01	Feb 2011
This standard applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This standard documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This standard applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs). Material and their containers previously marked or labeled according to JESD 97 or IPC-1066 need not be remarked unless agreed upon by the supplier and customer. Committee(s): JC-14.4, JC-14 Download J-STD-609A.01 Free download. Registration or login required.
JOINT JEDEC/ECA STANDARD, DEFINING “LOW-HALOGEN” ELECTRONIC PRODUCTS (REMOVAL OF BFR/CFR/PVC) This document replaces JEP709 and JS709.	JS709A	May 2012
This standard provides terms and definitions for "low-halogen" electronic products that have the potential to contain the halogens Br and Cl from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling. Committee(s): JC-14.4, JC-14 Download JS709A Free download. Registration or login required.

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