Standards & Documents Search: JC-11.11: Microelectronic Plastic Packages

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Title	Document #	Date
Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.	MO-285-A	Aug 2007
Item 11.11-760 and 11.11-760(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.	MO-284-A	May 2007
Item 11.11-755 Patent(s): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.	MO-286-A	Jan 2007
Item 11.11-771 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.	MO-273C	Mar 2011
Item 11.11-841 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.	MO-270-B	Jun 2008
Item 11.11-790 Patent(s): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.	MO-298-A	Jun 2009
Item 11.11-816 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.	MO-149-F	Oct 2003
Committee(s): JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patent(s): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Small Outline Package (Shrink SOT). TR-PDSO-G.	MO-193D	Aug 2010
Item 11-833 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.	MO-195-D	May 2006
Item 11.11-704 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Small Outline (Shrink SOT). R-PDSO-G	MO-203C	Aug 2010
Item 11.11-834 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.	MO-208-C	Nov 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.	MO-217-B	Nov 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.	MO-226-B	Feb 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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