Standards & Documents Search: JC-11.2: Design Requirements

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Title	Document #	Date
Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).	DR-4.6D.01	Jul 2012
Item 11.2-838(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.	DR-4.7E.01	May 2010
Item 11.2-829R Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature.	DG-4.10D	Oct 2002
Item 11.2-615s Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA).	DR-4.14G.01	Apr 2011
Item 11.2-837(R) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Thin Small Outline Package, TSOP - Type 2.	DG-4.15B	May 2004
Item 11.2-675(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.	SPP-014	Jul 1994
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009Status: Rescinded March 2009	SPP-017-C	Nov 2004
Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - New SPP to clarify how A1 is to be measured. Item 11.2-595s	SPP-019-A	Jul 2001
Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Metric Small Outline J-Leaded Package Design Guide	DG-4.13	Aug 1996
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)	SPP-020A	Jul 2003
Committee(s): JC-11.2, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.	DG-4.19D	May 2007
Item 11.2-765(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).	DR-4.20D.01	Sep 2009
Item 11.2-820(R) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).	DG-4.18A	Nov 2004
Item 11.2-647(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)	SPP-022B	Mar 2006
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.	DG-4.23A	Nov 2005
Item 11.2-728(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Fine-pitch, Square Ball Grid Array Package (FBGA) Package-on-Package (PoP).	DR-4.22C.02	Mar 2011
Item 11.2-839(R) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors	SPP-023B	Feb 2013
Item 11.11-781(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA) This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-836(R)	DR-4.25A	Nov 2011
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Registration - Micropillar Grid Array (MPGA) Item 11.2-845(R)	DR-4.26A	Dec 2011
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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