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Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).
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DR-4.6D.01 |
Jul 2012 |
Item 11.2-838(S)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.
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DR-4.7E.01 |
May 2010 |
Item 11.2-829R
Committee(s):
JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature.
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DG-4.10D |
Oct 2002 |
Item 11.2-615s
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA).
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DR-4.14G.01 |
Apr 2011 |
Item 11.2-837(R)
Committee(s):
JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Thin Small Outline Package, TSOP - Type 2.
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DG-4.15B |
May 2004 |
Item 11.2-675(s)
Committee(s):
JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.
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SPP-014 |
Jul 1994 |
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009Status: Rescinded
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SPP-017-C |
Nov 2004 |
Committee(s):
JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Standard Practices and Procedures - New SPP to clarify how A1 is to be measured. Item 11.2-595s
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SPP-019-A |
Jul 2001 |
Committee(s):
JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Metric Small Outline J-Leaded Package Design Guide
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DG-4.13 |
Aug 1996 |
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)
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SPP-020A |
Jul 2003 |
Committee(s):
JC-11.2, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.
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DG-4.8C |
Sep 2006 |
Item 11.2-713(s)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.
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DG-4.19D |
May 2007 |
Item 11.2-765(s)
Committee(s):
JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).
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DR-4.20D.01 |
Sep 2009 |
Item 11.2-820(R)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).
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DG-4.18A |
Nov 2004 |
Item 11.2-647(s)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)
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SPP-022B |
Mar 2006 |
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.
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DG-4.23A |
Nov 2005 |
Item 11.2-728(S)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Fine-pitch, Square Ball Grid Array Package (FBGA) Package-on-Package (PoP).
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DR-4.22C.02 |
Mar 2011 |
Item 11.2-839(R)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors
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SPP-023B |
Feb 2013 |
Item 11.11-781(S)
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA)
This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-836(R)
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DR-4.25A |
Nov 2011 |
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Design Registration - Micropillar Grid Array (MPGA)
Item 11.2-845(R)
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DR-4.26A |
Dec 2011 |
Committee(s):
JC-11, JC-11.2 JEP95 Registrations Main Page
Free download. Registration or login required. |