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Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.
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MO-285-A |
Aug 2007 |
Item 11.11-760 and 11.11-760(E)
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.
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MO-284-A |
May 2007 |
Item 11.11-755 Patent(s): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.
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MO-286-A |
Jan 2007 |
Item 11.11-771
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.
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MO-287-A |
Sep 2007 |
Item 11.11-777
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.
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MO-288-B |
Sep 2009 |
Item 11.11-821
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.
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MO-291-B |
Dec 2008 |
Item 11.11-805 Patent(s): Amkor: 6818973; 7211471
Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.
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MO-294-A |
Nov 2008 |
Item 11.11-804
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.
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MO-273C |
Mar 2011 |
Item 11.11-841
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.
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MO-270-B |
Jun 2008 |
Item 11.11-790 Patent(s): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers.
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MO-282-A |
Jan 2007 |
Item 11.14-099 Patent(s): STAKTEK: See Outline
Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.
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MO-283-B |
Jan 2008 |
Item 11.4-782 Patent(s): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT).
Committee(s):
JC-11, JC-11.4, JC-65 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.
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MO-298-A |
Jun 2009 |
Item 11.11-816
Committee(s):
JC-11, JC-11.11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.
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MO-271-A |
Jun 2006 |
Item 11.11-738
Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.
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MO-001-F |
Jun 1983 |
Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.
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MO-002-B |
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Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.
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MO-002-C |
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Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).
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MO-004-C |
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Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
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Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.
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MO-005-B |
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Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.
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MO-006-C |
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Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |
|
Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.
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MO-006-D |
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Committee(s):
JC-11 JEP95 Registrations Main Page
Free download. Registration or login required. |