Standards & Documents Search: JC-13: Government Liaison

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Title	Document #	Date
STATISTICAL PROCESS CONTROL SYSTEMS	EIA557B	Jan 2006
SPC embraces a management philosophy of continuous process improvement that has a primary focus on prevention of defects. After a process has been characterized using statistical techniques (i.e., design experiments (DOE), capability studies, etc.), SPC is a tool that can be applied to control and optimize the process and reduce variability. An acceptable approach toward an SPC system involves the use of 'end-of-process' data to control the process through the application of SPC techniques. However, the intent of this standard is to emphasize the use of in-process data in order to better control and forecast system quality. This proactive use of SPC in conjunction with other techniques and the appropriate responsiveness to out-of-control situations serves to make SPC techniques critical in continuous process improvement and achieving excellence. Committee(s): JC-13.5, JC-13 Download EIA557B Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORSStatus: Rescinded May 2006	EIA623	Jul 1994
Committee(s): JC-13 Download EIA623 Free download. Registration or login required.
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES: Removed 01/21/04	J-STD-002B	Feb 2003
At the request of IPC, J-STD-002B has been temporarily removed from the free download area until such time when it is revised to include lead-free In its place, JEDEC's Test Method B102-D, Solderability, which includes lead-free, is available for free downloading Committee(s): JC-14.1, JC-13 Download J-STD-002B Free download. Registration or login required.
JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS: RESCINDED, May 2006Status: Rescinded May 2006	JEP101-C	Nov 1995
Committee(s): JC-13.2 Download JEP101-C Free download. Registration or login required.
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP105	Apr 1983
Committee(s): JC-13.5 Download JEP105 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP107	Apr 1985
Committee(s): JC-13.5 Download JEP107 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:Status: Rescinded	JEP109-C	Mar 1995
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Download JEP109-C Free download. Registration or login required.
TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.Status: Rescinded Jun-96	JEP111	Jan 1986
Committee(s): JC-13.2, JC-13
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded	JEP112	Jun 1987
Committee(s): JC-13 Download JEP112 Free download. Registration or login required.
GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION:	JEP114.01	Oct 2007
This publication was developed to help the user of this test methodology avoid common interference ∆s to successful application. The guide contains sections on typical specification requirements, sources of particles, PIND test systems, calibration, maintenance, test interference's, operator training, particle recovery and failure analysis. Application of the information contained in the guide will improve the quality and affectivity for any PIND testing operation. Committee(s): JC-13.5, JC-13 Download JEP114.01 Free download. Registration or login required.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:	JEP121A	Oct 2006
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee(s): JC-13.2, JC-13 Download JEP121A Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE:Status: Reaffirmed September 2003, January 2007	JEP132	Jul 1998
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. In December 2004 the document was renumbered to conform with JM7, JEDEC Style Manual. Committee(s): JC-13 Download JEP132 Free download. Registration or login required.
GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:	JEP133C	Jan 2010
A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500. Committee(s): JC-13.4, JC-13.5 Download JEP133C Free download. Registration or login required.
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS:Status: Reaffirmed <p>September 2009</p>	JEP142	May 2002
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Committee(s): JC-13.5, JC-13 Download JEP142 Free download. Registration or login required.
GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES	JEP144	Jul 2002
The intent of this document is to give guidance on the Residual Gas Analysis (RGA) process and surrounding issues. The guideline describes how to select a suitable test lab and includes RGA history, measurement methodology, and issues that arise with the test. Interpreting the lab results along with common failure mechanisms are discussed at length along with process controls and alternative test techniques for measuring the moisture content within packages. Committee(s): JC-13 Download JEP144 Free download. Registration or login required.
GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICESStatus: Rescinded	JEP96	Jan 1977
Committee(s): JC-13.5
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM):Status: Reaffirmed September 2008	JESD16-A	Apr 1995
This standard was revised to clarify assumptions necessary to estimate AOQ, revise the minimum sample size algorithm, address small sample size concerns, and provide methods for combining groups for AOQ estimation. Derivation of any new methods for combing groups for AOQ estimation. Derivation of any new methods introduced into this document have been provided in annexes. A statistical method is based on confidence interval statistics. A procedure was established for reporting AOQ when the minimum sample size criterion is not met. Not all sections of EIA-554 are appropriate for use by device manufacturers therefore JEDEC wishes to continue using JESD16A. In December 2008 the formulating committee approved to remove EIA-554 (July 1996, Reaffirmed September 2002) from the JEDEC website. To obtain a copy of EIA-554 please contact GEIA at http://www.geia.org/ Committee(s): JC-13 Download JESD16-A Free download. Registration or login required.
GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-AStatus: Rescinded	JESD19	Jul 1988
Committee(s): JC-13 Download JESD19 Free download. Registration or login required.
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT	JESD213	Mar 2010
This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engineers, procuring activities and repair centers. This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn/Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment. Committee(s): JC-13 Download JESD213 Free download. Registration or login required.
GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001Status: Rescinded	JESD26-A	Apr 1990
Committee(s): JC-13.2 Download JESD26-A Free download. Registration or login required.

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