- Home
- About JEDEC
- Standards & Documents
- Committees
- JC-10: Terms, Definitions, and Symbols
- JC-11: Mechanical (Package Outlines) Standardization
- JC-13: Government Liaison
- JC-14: Quality and Reliability of Solid State Products
- JC-15: Thermal Characterization Techniques for Semiconductor Packages
- JC-16: Interface Technology
- JC-22: Diodes and Thyristors
- JC-25: Transistors
- JC-40: Digital Logic
- JC-42: Solid State Memories
- JC-45: DRAM Modules
- JC-63: Multiple Chip Packages
- JC-64: Embedded Memory Storage and Removable Memory Cards
- JC-65: RFID
- News
- Events & Meetings
- Join JEDEC
- Members Area
- Order JEP 95 and JESD21-C Related Products
- Privacy Policy
Standards & Documents Search: MO- (Microelectronic Outlines)
Results 101 - 120 of 306
Results
| Title |
Document # |
Date |
|---|---|---|
| Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329. | MO-109-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292. | MO-110-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. | MO-111-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422. | MO-112-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369. | MO-113-D | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357 | MO-114-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. | MO-115-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S. | MO-116-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289. | MO-117-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309. | MO-118-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Plastic Small Outline (SO) Package Family With .300 inch Body Width. Item 11.11-298. | MO-119-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Plastic Small Outline (SO) Package Family With .350 inch Body Width. Item 11.11-300. | MO-120-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301. | MO-121-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318. | MO-122-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304. | MO-123-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371. | MO-124-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303. | MO-125-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318. | MO-126-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Power Dual-In-Line Package. Item 11.10-297. | MO-127-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
| Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365. | MO-128-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
User login
Current search
[×]
Document Type
: MO- (Microelectronic Outlines)Search by Keyword or Document Number
Guided search
Click a term to refine your current search.
Committees
Document Type
: all » MO- (Microelectronic Outlines)Standards and Documents Assistance
Contact Julie Carlson, 703-624-9230