This document provides a guideline for the minimum set of measurements to qualify a new semiconductor wafer process. It is written with particular reference to a generic silicon based CMOS logic technology. While it may be applicable to other technologies (e.g. analog CMOS, bipolar, BICMOS, GaAs, etc.), some sections apply specifically to CMOS. No effort was made in the present document to cover all the qualification requirements for specific other technologies, e.g. Cu/Low K interconnects or ultra thin gate oxide. This publication, is co-sponsored by JEDEC JC-14.2 and the FSA (Fabless Semiconductor Association). It originated at the FSA as a technology specific document, and has evolved into a generic set of qualification requirements.
Committee(s):
JC-14.2, JC-14
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This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided.
Committee(s):
JC-14.1, JC-14
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