This publication includes registered outlines for transistors (TO as in TO-3), diodes (DO as in DO-41), microelectronics (MO as in MO-015 for DIPs and MO-047 for PLCC), uncased devices (UO as in UO-016 flatback) gauges (GS), and carrier and trays (CO as in CO-001 shipping tubes). Standard outlines also exist for transistors (as in TS-001) and DIPS (as in MS-001). JEDEC Publication 95-1 "Design Guidelines" document is contained in JEP-95 in Section 4 of Book 1. Surface mount semiconductor packages are contained in the publication but not as a separate section. For instance, industry type SOT-23 transistor is JEDEC type TO-236 in the TO section and Plastic Quad Flatpack is MO-086 in the MO section. surface mount resistors, capacitors and switches are not contained in Publication 95. Other related EIA publications contain information on these parts such as PDP-100.

The JEDEC JC-11 Committee on Mechanical Standardization creates the outlines in Publication 95 and is responsible for updating the publication. Each year approximately 4-6 updates are published. A special mailing list contains updated information. Most updates follow JC-11 meetings that occur quarterly. Subscription to the updates is an additional cost.The material in Publication 95 comes in two 4" wide 3-ring binders so that updates can be added with ease. The document presently consists of over 1800 pages of drawings. A master index is included to help in updating and completeness.

If you have any questions about Publication 95 or its contents, contact the JEDEC office at (703) 907-7558, or by Fax at (703) 907-7583, for more information.