package

See "ball-grid array", "can package", "chip carrier", "chip‑scale package", "clamped package", "die-size package", "disk-button package", "dual‑in‑line package", "flange-mount package", "flatpack", "grid-array package", "in-line module", "in‑line package", "long-form package", "microelectronic assembly", "post-mount package", "press‑fit package", "press-pack", "quad flatpack", "single-in-line package", "small‑outline package", "special-shape package", "stud-mount package", "uncased chip", "vertical surface‑mount package", and "wafer-level package".

References