An assembly of unpackaged (uncased) microcircuits and/or packaged microcircuits so constructed on a packaging interconnect structure that it is considered to be an indivisible component for the purpose of specification, testing, commerce, and maintenance.
NOTE The assembly may also include discrete devices. These and the microelectronic devices may be mounted on either one or two sides of the packaging interconnect structure, and the external terminals usually exit from one side of the assembly. Various package sizes, shapes, and external terminal forms may be used.
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