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bond-shear code for ball and wedge bond, type 2 - bond shear
A separation of the wire bond where 1) a thin layer of the bonding surface metallization remains with the wire bond and an impression is left in the bonding surface, 2) intermetallics remain on the bonding surface and with the wire bond, or 3) a major portion of the wire bond remains on the bonding surface.
References
JESD22-B116, 7/98Browse Alphabetically
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