Dictionary G

G

See "giga (as a prefix to units of semiconductor storage capacity)".

See "gate terminal".

The difference between the actual midstep [step] value and the nominal midstep [step] value in the transfer diagram at the specified gain point after the offset error has been adjusted to zero.

NOTE 1 The terms "gain error" and "offset error" should be used only for errors that can be adjusted to zero. Otherwise, the terms "zero-scale error" and "full-scale error" should be used.

NOTE 2 Usually the specified steps for the specification of gain error and offset error are the steps at the end of the practical full-scale range.

NOTE 3 The midstep value of a step is defined (for an analog-to-digital converter) as the value for a point ½ LSB apart from the adjacent transition.

JESD99B, 5/07

The point in the transfer diagram corresponding to the midstep [step] value of the step for which gain error is specified (usually full scale), and in reference to which the gain adjustment is performed.

NOTE Gain adjustment causes only a change of the slope of the transfer diagram, without changing the offset error.

JESD99B, 5/07

The electrode associated with the region in which the electric field due to the control voltage is effective.

JESD24, 7/85

A digital integrated circuit containing a fixed topology of circuit elements used to form macrocells and macro functions that are or can be interconnected to implement a logic function.

JESD12-1B, 8/93
JESD99B, 5/07

Synonym for "usable gates".

JESD12-1B, 8/93
JESD99B, 5/07

The physical area occupied by the logic gates and intercell routing excluding the pad cell area.

JESD12-1B, 8/93
JESD99B, 5/07

The physical area occupied by the available logic gates and intercell routing excluding the pad cell area.

JESD12-1B, 8/93
JESD99B, 5/07

The number of gates in the gate core area divided by the gate core area.

NOTE Units are gates per unit area.

(2) (of a gate array): The number of available gates in the gate core area divided by the gate core area.

NOTE Units are gates per unit area.

JESD12-1B, 8/93
JESD99B, 5/07

The direct current into the gate terminal.

JESD24, 7/85
JESD60A, 9/04
JESD90, 11/04

The (control) current into the gate terminal.

JESD77-B, 2/00

The gate charge at Vgs(pl) on the calculated line segment 2 less Qgs. (See the figure below.)

Turn-on gate waveform

JESD24-2, 1/91

The dc voltage between the gate terminal and the drain terminal.

JESD24, 7/85

The number of gate equivalents used to implement a function.

JESD12-1B, 8/93
JESD99B, 5/07

The minimum circuitry necessary to implement a two-input NAND gate.

(2) (for ECL): One-eleventh of the minimum circuitry necessary to implement a single-bit full-adder.

JESD12-1B, 8/93
JESD99B, 5/07

A structural description using logic gates as primitives.

JESD12-1B, 8/93
JESD99B, 5/07

A combinational logic function consisting of a number of inputs and outputs and performing one of the Boolean functions AND, OR, exclusive OR, NAND, NOR, or exclusive NOR.

NOTE For the purpose of specifying complexity, (1) buffers and inverters are counted as gates and (2) exclusive OR and exclusive NOR gates, some high-input-count gates, and memory functions are counted as multiple gates.

JESD12-1B#, 8/93
JESD99B, 5/07

The gate-source voltage when dVgs/dt first reaches a minimum during the turn-on switching transition, for a constant-gate-current drive condition. During turn-off, it is the gate-source voltage at the last minimum dVgs/dt observed.

Gate plateau voltage

JESD24-2, 1/91

A control region that determines the surface charge-carrier concentration in the channel region as a function of the gate voltage.

NOTE This definition applies for the actual operating mode of the device regardless of the name of any associated terminal.

(2) (of a JFET): A control region that determines the cross-sectional area of the channel region as a function of the gate voltage.

NOTE This definition applies for the actual operating mode of the device regardless of the name of any associated terminal.

(3) (of a thyristor): A control region in which a momentary injection of controlling charge causes a regenerative turn-on action.

NOTE This definition applies for the actual operating mode of the device regardless of the name of any associated terminal.

JESD77-B, 2/00

JESD77-B, 2/00

JESD77-B, 2/00

(1) The capacitance between the gate and source terminals with the drain terminal connected to the guard terminal of a three-terminal bridge.

(2) The capacitance between the gate and source terminals with the drain terminal open-circuited.

JESD24, 7/85


JESD24-11#, 8/96

The gate charge necessary to reach Vgs(pl) on the calculated line segment 1. (See the figure with "gate-drain charge".)

JESD24-2, 1/91

The gate charge necessary to reach a minimum specified gate threshold voltage.

JESD24-2, 1/91

The dc voltage between the gate terminal and the source terminal.

JESD24, 7/85
JESD28-A, 12/01
JESD60A, 9/04
JESD90, 11/04

The specified externally available point of connection to the gate region.

(2) (of a programmable unijunction transistor): The terminal whose bias conditions determine the values of the unijunction characteristics.

(3) (of a thyristor): The terminal unique to the control circuit.

JESD77-B, 2/00


JESD77-B, 2/00


JESD77-B, 2/00

The ratio of the number of used gates to available gates.

NOTE Gate utilization is usually expressed as a percentage.

JESD12-1B, 8/93
JESD99B, 5/07

Vibration characterized by having acceleration and frequency values that occur in a stochastic manner over an interval of time, with the acceleration values following a normal (Gaussian) probability density function and frequency values following a uniform distribution.

JESD22-B103B, 6/02
GEF

See "gate equivalency of a function".

A register, usually explicitly addressable, within a set of registers, that can be used for different applications, such as an accumulator, an index register, or a special handler of data. (Ref. IEC 824.)

JESD100-B, 12/99

A representation of a function in terms of its physical implementation.

JESD12-1B, 8/93
JESD99B, 5/07

A multiplier equal to 1 073 741 824 (230 or K3, where K = 1024).

NOTE 1 Contrast with the SI prefix giga (G) equal to 109, as in a 1‑Gb/s data transfer rate, which is equal to 1 000 000 000 bits per second.

NOTE 2 See note 2 to "mega (M)".

JESD100-B, 12/99

A short, undesirable transient in the analog output following a code change at the digital input.

JESD99B, 5/07

The time integral of the analog value of the glitch transient.

NOTE 1 Usually, the maximum specified glitch area refers to a specified worst-case code change.

NOTE 2 Instead of a letter symbol, the abbreviation "GA" is in use.

JESD99B, 5/07

The time integral of the electrical power of the glitch transient.

NOTE 1 Usually, the maximum specified glitch energy refers to a specified worst-case code change.

NOTE 2 Instead of a letter symbol, the abbreviation "GE" is in use.

JESD99B, 5/07

See "output enable".

GND

See "ground" and "ground reference or source power voltage (pin)".

See "output stage source power voltage or output stage ground reference (pin)".

A sample used to monitor the consistency of the beam and tester setup.

JESD89-3, 9/05

See "graphics DRAM".

A DRAM that contains special graphics features similar to those contained in an MPDRAM. (See also "synchronous graphics DRAM (SGRAM)".)

JESD21-C, 1/97

A package whose terminals are located on one surface in a matrix of at least three rows and three columns.

NOTE 1 Terminals may be missing from some row-column intersections.

NOTE 2 See also "ball-grid array".

JESD30D, 7/06

(1) The common or zero-potential pin(s) of the device under test.

NOTE 1 Ground pins are not latch-up tested.

NOTE 2 A ground pin is sometimes called VSS.

(2) A conducting connection, whether intentional or accidental, between an electrical circuit or equipment and the earth, or to some conducting body that serves in place of earth.

(3) The position or portion of an electrical circuit at zero potential with respect to the earth.

(4) A conducting body, such as the earth or the hull of a steel ship used as a return path for electric currents and as an arbitrary zero reference point.

JESD78A, 2/06

JESD625-A, 12/99


JESD625-A, 12/99

JESD625-A, 12/99

A designated connection, location, or assembly used on an electrostatic-discharge-protective (ESD-protective) material or device that is intended to accommodate electrical connection from the device to ESD ground.

JESD625-A, 12/99

The ground reference voltage pin for NMOS, CMOS, and TTL devices, commonly the reference pin for all other device pins. VSS is normally the system ground and the term VSS is often used interchangeably with the term GND.

JESD21-C, 1/97

A subdivision of a class based on inspection conditions or criteria (e.g., device type, product family, test temperature, sample size). Lots that are members of the same group receive the same set of inspections in that group.

JESD16-A, 4/95
GS

See "synchronous output enable".

GSF

See "transfer acknowledge output".

A transferred-electron diode intended to operate at a frequency determined by the transit time of charge packets or "domains" that are formed due to the transferred-electron effect.

JESD77-B, 2/00

A physical defect created during installation or operation.

NOTE    Generated defects are usually created by physical means (e.g., improper handling, electrostatic discharge) or by violation of maximum ratings.

JEP143B.01, 6/08

Browse Alphabetically

A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z

Standards and Documents Assistance

Contact Julie Carlson, 703-624-9230

Dictionary RSS Feed

Subscribe to the JEDEC Dictionary RSS Feed to receive updates when new dictionary entries are added.