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JEDEC ROSTER OF COMMITTEES
JULY 2008
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Chairman of the JEDEC Committees
(by Committee Number)


JC-10 Committee: Terms, Definitions, and Symbols

Fred A. Mann

JC-11 Committee: Mechanical (Package Outlines) Standardization

Takao Ono
Elpida Memory Inc.

Rudy Griffin (Vice-Chair)
National Semiconductor Corporation

JC-11.1 Subcommittee: Editorial Practices and Procedures

Inactive

JC-11.2 Subcommittee: Design Requirements

Glenn Koscal
Carsem Inc.

JC-11.4 Subcommittee: Uncased Devices

Michael Ahr
Infineon Technologies

JC-11.5 Subcommittee: Package Interface

Inactive

JC-11.7 Subcommittee: IEC Interface

Christine Blair
StMicroelectronics

JC-11.10 Subcommittee: Microelectronic Ceramic Packages

Willaim Strom
Freescale Semiconductor

JC-11.11 Subcommittee: Microelectronic Plastic Packages

Serafin Pedron (Chairman Pro-Tem)
ASAT Inc.

JC-11.14 Subcommittee: Microelectronic Assemblies

Tim Allen
Micron Technology, Inc.

JC-13 Committee: Government Liaison

Brent Rhoton
Texas Instruments, Inc.

JC-13.1 Subcommittee: Discrete Devices

Chris Velador
Semtech Corporation

Carl Mowry (Vice-Chair)
Microsemi Corporation

JC-13.2 Subcommittee: Microelectronic Devices

Lee Mathiesen
Lansdale Semiconductor Inc.

JC-13.4 Subcommittee: Radiation Hardness: Assurance and Characterization

Reed Anderson
BAE Systems

JC-13.5 Subcommittee: Hybrid, RF/Microwave, and MCM Technology

Daniel Miller
M.S. Kennedy Corporation

TBD (Vice-Chair)

JC-14 Committee: Quality and Reliability of Solid State Products (Note: JC-17 merged with JC-14)

Nick Lycoudes
Freescale Semiconductor

JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices

Jack McCullen
Intel Corporation

JC-14.2 Subcommittee: Wafer-Level Reliability

Alvin Strong
IBM Corporation

Dan Oliver (Vice-Chair)
NXP Semiconductors

JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring

Bruce Euzent
Altera Corporation

Joel Heebink (Vice-Chair)
Honeywell

JC-14.4 Subcommittee: Quality Processes and Methods (JC-14.5 merged with JC-14.4)

Curtis Grosskopf
IBM

TBD (Vice-Chair)

JC-14.6 Subcommittee: Failure Analysis

TBD

JC-14.7 Subcommittee: Gallium Arsenide Reliability and Quality Standards

Peter Ersland
Tyco Electronics M/A-COM

JC-15 Committee: Electrical and Thermal Characterization Techniques for Electronic Packages and interconnects

Bruce Guenin
Sun Microsystems

Sarang Shidore (Vice-Chair)
Flomerics Inc.

JC-16 Committee: Voltage Level and Electrical Interface

Doug Stout
IBM Corporation

Roleof Salters (Vice-Chair)
NXP Semiconductors

JC-22 Committee: Diodes and Thyristors

Kent Walters
Microsemi Corporation

JC-22.1 Subcommittee: Thyristors

John Donlon
Powerex, Inc.

JC-22.2 Subcommittee: Rectifiers, Zeners and Signal Diodes

Kent Walters
Microsemi Corporation

JC-22.5 Subcommittee: Transient Voltage Suppressors

William Travis
Littelfuse, Inc.

JC-25 Committee: Transistors

John Donlon
Powerex, Inc.

JC-40 Committee: Digital Logic

John Smolka
Integrated Device Technology, Inc.

Ingolf Frank (Vice-Chair)
Texas Instruments, Inc.

JC-40.1 Subcommittee: CMOS/BiCMOS Digital Logic

Rick Williams
Sun Microsystems

JC-40.3 Subcommittee: RDIMM Support Devices

Ramzi Ammar
Integrated Device Technology

JC-40.4 Subcommittee: FBDIMM Support Devices

Myron Miske
Fairchild Semiconductor

JC-40.5 Subcommittee: Logic Verification and Validation

Perry Keller
Agilent Technologies

JC-42 Committee: RAM Memory

Desi Rhoden
Montage Technology Group Ltd.

Roleof Salters (Vice-Chair)
NXP Semiconductors

JC-42.2 Subcommittee: SRAM

Vijay Davar
Cypress Semiconductor

JC-42.3 Subcommittee: Volatile RAM

Joe Macri
Advanced Micro Devices, Inc.

Clement Fang (Vice-Chair)
Sun Microsystems

JC-42.3B Letter Subcommittee: RAM Functions and Features

Kevin Ryan
Micron Technology, Inc.

Dr. William Shen (Vice-Chair)
Qimonda AG

JC-42.3C Letter Subcommittee:RAM Parametrics

Todd Farrell
Micron Technology, Inc.

Jang Seok Choi (Vice-Chair)
Samsung Semiconductor

JC-42.3D Letter Subcommittee: RAM Package Pinouts

Mario Martinez
Netlist Inc.

Mark Farley (Vice-Chair)
Freescale Semiconductor

JC-42.4 Subcommittee: Non-Volatile Memory

Dong Yang Lee
Samsung Semiconductor

Cecil Ho (Vice-Chair)
CST Inc.

JC-42.6 Subcommittee: Low Power Memory

Roger Isaac
Spansion Inc.

Scott Graham (Vice-Chair)
Micron Technology, Inc.

 

JC-45 Committee: DRAM Modules

Mian Quddus
Samsung Semiconductor

Peter Linder (Vice-Chair)
Nanya Technology Corporation

JC-45.1 Subcommittee: R-DIMM

Oliver Kiehl
Qimonda AG

Takao Ono (Vice-Chair)
Elpida Memory Incorporated

JC-45.2 Subcommittee: U-DIMM

David Chan
Qimonda AG

Yongshin Kim (Vice-Chair)
Hynix Semiconductor

JC-45.3 Subcommittee: Small DIMM

Kazuyoshi Tsukada
Buffalo Inc.

Sung Joo Park (Vice-Chair)
Samsung

JC-45.4 Subcommittee: FB-DIMM

Paul Goodwin
Avant Technology

JJ Lee (Vice-Chair)
Samsung Semiconductor

JC-45.5 Subcommittee: Module Interconnect

Bill Gervasi
US Modular

Mario Martinez (Vice-Chair)
Netlist Inc.

JC-61 Committee: Wireless Interface Network Group

Inactive
.

JC-63 Committee: Multiple Chip Package

James Malatesta
Numonyx B.V.

Dong Yang Lee (Vice-Chair)
Samsung Semiconductor

JC-64 Committee: Flash Memory Module

Mian Quddus
Samsung

Dave Eggleston (Vice-Chair)
Unity Semiconductor

JC-64.1 Subcommittee: Electrical Specifications

Kimmo Mylly
Nokia Corporation

Uli vom Bauer (Vice-Chair)
Qimonda AG

JC-64.2 Subcommittee: Mechanical Specifications

Curtis Zwenger
Amkor Technology

Mario Martinez (Vice-Chair)
Netlist Inc.

JC-64.3 Subcommittee: Host Controller

Kevin Silver
Denali Software Inc.

Perry Keller (Vice-Chair)
Agilent Technologies

JC-65 Committee: RFID

Navin Bhandarkar
Texas Instruments Inc.

Sylvain Fidelis (Vice-Chair)
STMicroelectronics

Software Committee

Fred Jones
Mosel Vitelic Corporation

 


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