ARLINGTON, Va., USA – SEPTEMBER 18, 2013 – JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of Universal Flash Storage (UFS) version 2.0. Developed for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v2.0 standard offers increased link bandwidth for performance improvement, a security features extension as well as additional power saving features over the prior version. JESD220B Universal Flash Storage v2.0 may be downloaded free of charge from the JEDEC website: http://www.jedec.org/standards-documents/results/jesd220b.
UFS is a high performance interface designed for use in computing and mobile systems requiring low power consumption such as smart phones and tablets. Its high speed serial interface and optimized protocol enable significant improvements in throughput and system performance. Dramatic growth in the mobile market coupled with an increasing focus on multimedia applications continues to drive both usage models and memory bandwidth requirements, and UFS v2.0 builds on JEDEC Flash memory storage standards designed to help address this demand. In UFS v2.0, the link bandwidth has been increased from 300 MB/s in UFS v1.1 to up to 600 MB/s per lane, and multilane support has been introduced allowing up to 1.2 GB/s per each data transfer direction.
To achieve the highest performance and most power efficient data transport, JEDEC UFS aligns with industry–leading specifications from the MIPI® Alliance to form its Interconnect Layer. This collaboration continues with UFS v2.0, which references the M-PHY® Version 3.0 specification and the UniProSM Version 1.6 specification.
JEDEC has also published two complementary standards, JESD223B UFS Host Controller Interface (UFSHCI) version 2.0, and JESD223-1 UFS Host Controller Interface (UFSHCI), Unified Memory Extension. JESD223B is intended to simplify the design process by defining a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. The JESD223-1 UFSHCI Unified Memory Extension standard defines the interface between the UFS driver and the UFS host controller. In addition to the register interface, it defines data structures inside the system memory, which are used to exchange data, control and status information. Unified Memory offers the possibility to move device internal working memory into the system memory to reduce overall system cost and to improve device performance. JESD223B and JESD223-1 may also be downloaded free of charge from the JEDEC website.
"UFS v2.0 offers a clear value proposition to the industry, with significant performance improvements that will lead to a better overall mobile device user experience," said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards. He added, "Memory manufacturers and leading consumer device and mobile OEMs strongly support UFS and have devoted countless hours to the development of this latest update."
"UFS 2.0 will drive next generation mobile devices to new performance levels not available before," said UFSA President Lisa Rhoden. "The new JEDEC standard demonstrates the power of industry leaders working together to benefit consumers around the world."
"The substantial performance improvement provided by UFS 2.0 will accelerate the already strong momentum of UFS in the mobile market," said Andrew Haines, Vice President of Marketing for Arasan Chip Systems. "We are pleased to have contributed to JEDEC's effort to rapidly evolve the standard in order to meet the needs of consumers and our UFS IP customers."
"UFS technology continues to evolve with generation 2.0. With a higher bandwidth and features consolidation, the spec responds to emerging mobile challenges," said Micron Senior Director for Wireless Solutions Group - Mobile Technology, Marco Dallabora. "Standardization activities have been focused to create a differentiating solution in the mobile storage arena."
"The mobile industry has been waiting for much higher performing, high efficiency storage devices and Samsung sees the new UFS 2.0 JEDEC standard as empowering the production of flash devices that easily meet this need," said JaeHyeong Lee, vice president, memory product planning & application engineering, Samsung Electronics. "The UFS 2.0 standard will spur development of the finest Samsung mobile storage devices, whose performance equates to that of high-performance solid state drives, and which will enable the next generation of high performance computing devices with a significantly better experience for mobile consumers."
"Building on the strong demand for UFS, the UFS v2.0 standard brings higher performance and lower power consumption to provide a richer mobile experience in streaming video and data content," said John Koeter, vice president of marketing for IP and systems at Synopsys. "As an active participant in JEDEC and MIPI Alliance working groups for more than a decade, Synopsys is committed to supporting and promoting the evolution and adoption of the latest standards."
"Toshiba is expecting great potential on next generation mobile storage, UFS, and will continue our contribution to the market expansion and standardization by JEDEC through developing UFS memory device and supporting UFS host IP," said Shigeo Ohshima, Technology Executive of Toshiba Corporation Semiconductor Company. "With the advent of UFS 2.0, standardized Unified Memory Extension (UME) will enable further increase of performance, which Toshiba expects to trigger the expansion of UFS market from smartphone / tablet to more performance demanding markets, such as personal computers."
JEDEC is the leading developer of standards for the microelectronics industry. Over 4,000 participants, appointed by nearly 300 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.
MIPI® Alliance, M-PHY® and UniProSM are marks of MIPI Alliance, Inc.