Mobile & IOT Forum Taiwan

Friday, August 19 • Hsinchu

The Mobile & IOT Forum in Hsinchu was a great success; over 200 attendees gathered to hear the latest updates on JEDEC standards related to the mobile and IOT markets.

Morning Session

IoT as an Integral Part of Everyday Life

IoT opportunities are emerging from specific industrial/vertical to consumer-oriented, from personal, to home, to automotive to infrastructure…almost happening in every application domains. Technologies are key drivers for IoT, such as application platform, connectivity portfolio, high integration SOC, and premium multimedia, all enable cloud computing, big data analysis, visioning & sensing tech., and machine learning. We believe that User Experience is now driving the choice and the usage of the technology. Usage scenarios identification definitely is the key for low power technologies. Mediatek’s experiences in low power mobile SOC can truly drive the development of low power technologies for IoT devices application.
Keynote Presenter: Dr. SA Hwang, Mediatek


Value-Added Packaging Integration for Mobile and Wearable Applications

Semiconductor foundries and traditional backend OSAT companies are racing to develop advanced, value-added packaging systems for mobile, wearable, and IoT applications.  We will review recent technology advancement in the design and application of complex, value-added high performance package systems including System in Package (SiP), Fan-out wafer level package (FOWLP), modular multichip packages and memory/SOC package-on package (PoP) that can achieve system level form factor reduction while lowering power consumption.  The new package system integration (PSI) require advanced materials (molding compound, solder paste, thin substrates), high precision automated manufacturing SMT equipment, and updated JEDEC standards and specifications.  Such profound impact by PSI on design, materials, equipment, advanced assembly process, and newer standards are discussed.  
Keynote Presenter: Wei Koh, Huawei
10:30-11:00AM Introducing the Next Generation of Mobile Storage: eUFS and the UFS Card

Demand for faster mobile storage is dramatically increasing everywhere we look. To satisfy this insatiable market demand, requirements for an embedded UFS (Universal Flash Stoarge) mobile storage standard have just been specified by JEDEC, and a standard for removable UFS cards is now being defined. As the industry gears up to introduce an array of UFS solutions, it’s important to have a firm understanding of the technology behind these products. Samsung will discuss the architecture for UFS, as well as key features of eUFS and UFS Card technology.  We also will examine the latest market trends for mobile storage, including the speed at which the industry is moving to embrace UFS.
Presenter: HeeChang Cho, Samsung

Mobile & IOT Market Trends and Memory Requirements

Wearable devices are one of the fastest growing forces in the market, faced with many challenges brought on by diverse requirements. The challenges include behavioral challenges such as price, social acceptance, etc., as well as technical considerations such as battery life, thermal constraints, and an evolving software ecosystem. This presentation will describe the wearable system architecture for each market segment, and report on the various CPU, GPU, and memory requirements for the architecture.
Presenter: Ivan Lin, ARM


Architectural Options for LPDDR4 Implementation in Your Next Chip Design
LPDDR4 is the first JEDEC standard that specifies two DDR DRAM channels per die, and packages with four LPDDR4 DDR DRAM channels, giving chip architects new options when designing chips that connect to LPDDR4. This presentation will review the ways to take advantage of this native multichannel LPDDR4 capability. It will discuss how you can to divide memory traffic across the channels of LPDDR4, how to activate the low-power features of LPDDR4, how to make the electrical connection to LPDDR4, how to floorplan the chip design, and key features of the LPDDR4 memory subsystem.
Presenter: Marc Greenberg, Synopsys

Noon-1:00PM Lunch Break

Afternoon Session


Embracing the Next Wave: Moving from Convergence to Divergence
The evolution of smartphones to date can be defined as “digital convergence,” as smartphones have been providing more and more features for their users. Now, the industrial world is changing. Users want to enjoy enhanced “smart” functionality not only for their smartphones, but also for the many other versatile digital devices that make up their environment. So the next wave of digital innovation can be referred to as “Digital Divergence.” This means that smartphones will enable “digital optimization” by providing functionality that satisfies an extensive set of demands from the widest range of electronic devices in the Internet of Things.  This keynote will explore how smartphones will now evolve to accommodate the rapidly growing number of divergent applications, highlighting the capacity of these “hub-like” universal control units to deliver optimized mobile DRAM solutions.
Presenter: Minhwan An, Samsung


Assuring Customer Satisfaction and Competitive Advantage with the UFS Logo
JEDEC developed Universal Flash Storage (UFS) to succeed eMMC and support the next generations of mobile and IoT devices.   Now UFS is beginning to show up in shipping products and an end-user installable card form factor is being defined by JEDEC. Products that take advantage of UFS’ new capabilities will achieve greater customer satisfaction and therefore a competitive advantage. It’s important that both system designers and end users know that UFS is included to provide improved performance, efficiency and price/performance flexibility.  The UFS logo is the best way to let users know that they are buying a superior product. This session explains how products can earn the UFS logo and achieve the competitive advantages they expect.
Presenter: Perry Keller, Keysight


Low Power DRAM Evolution
Low Power DRAM has evolved from a lower-voltage, lower-performance version of PC-DRAM designed for mobile packages to become one of the highest bandwidth-per-pin types of DRAM available. Along with this trend, the mobile system limitations now include active battery life and thermal limits in addition to standby battery life. This change in system limitations affects the choice of future LPDRAM architectures, beginning with the evolution of the LPDDR4 standard. Power efficiency across a range of bandwidths will become a more important attribute than raw peak bandwith. This presentation will investigate some proposed and alternative architectures and power saving techniques.
Presenter: Osamu Nagashima, Micron


3D Will Revolutionize Mobile Industry
As the demand for larger capacity at a lower price steadily increases, technology such as feature size scaling down has also been developed.  However, scaling down lithography is reaching its limits.  As a result, multi-level cell and 3D structures are being presented as alternative solutions for this issue. The 3D structure will give us the chance to expand our technology for several more generation. SK hynix is also paving the way in the development of new technologies.
Presenter: Sang Don Lee, SK Hynix


Present and future packaging solutions for the Mobile/IoT Industry
This session will cover the current and future package assembly technologies for mobile memories and IoT devices. Following the mobile technologies which are used for cellular communications, we'll discuss why IoT is the next big thing for business, memories for IoT edge devices, memory technology trends and next generation packaging solutions. The presentation will also look into how JEDEC brings Chinese electronic manufacturers and suppliers together to participate in the effort to create open industry standards.
Presenter: Andrew Peng, Nantong, Fujitsu 

Program, topics and speakers subject to change without notice.

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