JEDEC Committee:

Multiple Chip Packages JC-63

JC-63 defines/proposes standards for mixed-technology MCP that address unique electrical, mechanical, test, and architecture issues relating to die-to-die design and manufacturing for commercial applications.

MCP is defined as multichip package, a single package that contains multiple dice, including memory-memory, logic-memory, logic-logic, and/or passive components.

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Committee Meetings

Orlando 8 - 12 Dec 2014
Seoul 2 - 6 Mar 2015
Vancouver 1 - 5 Jun 2015
San Diego 31 - 4 Sep 2015
Ft. Lauderdale 7 - 11 Dec 2015

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