JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
|FIELD-INDUCED CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND THRESHOLDS OF MICROELECTRONIC COMPONENTS||JESD22-C101F||Oct 2013|
|QUALITY SYSTEM ASSESSMENT (SUPERSEDES EIA670):||JESD670A||Oct 2013|
|GUIDE TO STANDARDS AND PUBLICATIONS RELATING TO QUALITY AND RELIABILITY OF ELECTRONIC HARDWARE||JEP70C||Oct 2013|
|CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST||JESD22-A100D||Jul 2013|
|MECHANICAL SHOCK – COMPONENT AND SUBASSEMBLY||JESD22-B110B||Jul 2013|
|STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS||JEP150.01||Jun 2013|
|CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES||JEP167||Apr 2013|
|SALT ATMOSPHERE||JESD22-A107C||Apr 2013|
|SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNS||JEP162||Jan 2013|
|GUIDELINES FOR VISUAL INSPECTION AND CONTROL OF FLIP CHIP TYPE COMPONENTS (FCxGA)||JEP170||Jan 2013|
|JC-14.1||Reliability Test Methods for Packaged Devices|
|JC-14.3||Silicon Devices Reliability Qualification and Monitoring|
|JC-14.4||Quality Processes and Methods|
|JC-14.7||Gallium Arsenide Reliability and Quality Standards|