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JEDEC Committee:
Quality and Reliability of Solid State Products JC-14
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
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- JC-14 and Subcommittees
Recent Documents
| Title | Document # |
Date |
|---|---|---|
| FIELD-INDUCED CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND THRESHOLDS OF MICROELECTRONIC COMPONENTS: | JESD22-C101E | Dec 2009 |
| 3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions | JEP158 | Nov 2009 |
| ELECTRICAL PARAMETERS ASSESSMENT: | JESD86A | Oct 2009 |
| PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE | JESD22-B112A | Oct 2009 |
| RECOMMENDED ESD-CDM TARGET LEVELS | JEP157 | Oct 2009 |
| EXTERNAL VISUAL: | JESD22-B101B | Aug 2009 |
| WIRE BOND SHEAR TEST | JESD22-B116A | Aug 2009 |
| CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION: | JEP156 | Mar 2009 |
| FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES: | JEP122E | Mar 2009 |
| STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST: | JESD22-A101C | Mar 2009 |
Recent News
Subcommittees
| Status (status) | ||
|---|---|---|
| JC-14.1 | Reliability Test Methods for Packaged Devices | |
| JC-14.2 | Wafer-Level Reliability | |
| JC-14.3 | Silicon Devices Reliability Qualification and Monitoring | |
| JC-14.4 | Quality Processes and Methods | |
| JC-14.6 | Failure Analysis | |
| JC-14.7 | Gallium Arsenide Reliability and Quality Standards |
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