JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
|CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES||JEP167||Apr 2013|
|SALT ATMOSPHERE||JESD22-A107C||Apr 2013|
|SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNS||JEP162||Jan 2013|
|GUIDELINES FOR VISUAL INSPECTION AND CONTROL OF FLIP CHIP TYPE COMPONENTS (FCxGA)||JEP170||Jan 2013|
|RF BIASED LIFE (RFBL) TEST||JESD226||Jan 2013|
|GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES||JESD31D.01||Sep 2012|
|BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS||JESD22-B113A||Sep 2012|
|STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS||JESD47I||Jul 2012|
|SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES:||JEP143C||Jul 2012|
|COMPONENT QUALITY PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS (INCLUDING ADMINISTRATIVE QUALITY PROBLEMS)||JESD671B||Jun 2012|
|JC-14.1||Reliability Test Methods for Packaged Devices|
|JC-14.3||Silicon Devices Reliability Qualification and Monitoring|
|JC-14.4||Quality Processes and Methods|
|JC-14.7||Gallium Arsenide Reliability and Quality Standards|