JC-13 is responsible for standardizing quality and reliability methodologies for solid state products used in military, space, and other environments requiring special-use condition capabilities beyond standard commercial practices. This includes long-term reliability and/or special screening requirements.
Its purpose is to provide the member companies and their customers with uniform, cost-effective, proven, customer-accepted methodologies for specifying and evaluating special-use products, with the end goal of enhancing the performance and reliability of those products. Activities include the development, coordination, and maintenance of standards documents regarding product quality and reliability, validation systems, and process management.
The committee also contributes to similar and related documents that are generated and maintained by other organizations. To accomplish this charter, the committee maintains liaisons with customers, other JEDEC committees, government agencies, and interested parties that have special application needs.
|GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES||JESD31E||Nov 2016|
|COUNTERFEIT ELECTRONIC PARTS: NON-PROLIFERATION FOR MANUFACTURERS||JESD243||Mar 2016|
|SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS||JEP163||Sep 2015|
|PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)||JESD49A.01||Oct 2013|
|TEST STANDARD FOR THE MEASUREMENT OF PROTON RADIATION SINGLE EVENT EFFECTS IN ELECTRONIC DEVICES||JESD234||Oct 2013|
|REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES||JESD625B||Dec 2011|
|GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES||JEP144A||Nov 2011|
|ALPHA RADIATION MEASUREMENT IN ELECTRONIC MATERIALS||JESD221||May 2011|
|INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS||JESD9B||May 2011|
|STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT||JESD213||Mar 2010|
|JC-13.5||Hybrid, RF/Microwave, and MCM Technology|
|JC-13.7||New Electronic Device Technology|